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半导体行业废水的反渗透膜污堵机制与控制策略
引用本文:徐雨晴,巫寅虎,吴乾元,王文龙,熊江磊,罗嘉豪,肖卓远,胡洪营.半导体行业废水的反渗透膜污堵机制与控制策略[J].环境科学研究,2023,36(3):535-545.
作者姓名:徐雨晴  巫寅虎  吴乾元  王文龙  熊江磊  罗嘉豪  肖卓远  胡洪营
作者单位:1.清华大学环境学院,环境模拟与污染控制国家重点联合实验室,国家环境保护环境微生物利用与安全控制重点实验室,环境前沿技术北京实验室,北京 100084
基金项目:国家自然科学基金重点项目(No.51738005);国家自然科学基金青年科学基金项目(No.51908317);国家自然科学基金面上项目(No.52070110)
摘    要:半导体行业是我国大力发展的高精尖产业,废水产生量大、再生处理难度高.半导体行业废水再生处理过程中,反渗透(reverse osmosis, RO)是重要的污染物去除单元,但面临的膜污堵问题严重影响了其效率与经济性.本文梳理了半导体行业废水的种类与典型污染物,总结了半导体行业废水导致反渗透膜污堵的主要机制及控制手段,提出了针对半导体行业废水特点的膜污堵控制策略.半导体生产的不同工序会产生多种废水,包括含氟废水、含磷废水、含氨废水、重金属废水、有机废水与酸碱废水等.废水中污染物种类多且可生化性普遍较差.通常,不同种类废水分类经分质收集后,进行相应的预处理,之后部分合流处理并进入RO系统.半导体行业废水中的金属离子或氟离子易在反渗透膜面形成无机结垢,表面活性剂易形成有机污堵.反渗透膜污堵可通过预处理、膜清洗与运行条件调控等手段进行控制,如超滤、EDTA清洗剂与pH调节等,但大部分现有手段对半导体行业废水造成的污堵控制能力有限.建议未来开发针对关键污染物的预处理技术与定制化的膜清洗方案;并结合半导体生产工序,提出针对污染物关键相互作用关系的废水收集与再生处理整体策略.

关 键 词:半导体行业废水  反渗透膜  膜污堵  关键污染物  重金属  表面活性剂
收稿时间:2022-08-09

Mechanism and Control Strategy of Reverse Osmosis Membrane Fouling in Semiconductor Industry Wastewater Treatment: A Review
Abstract:The semiconductor industry is a fast-growing high-tech industry in China, which produces a large amount of wastewater with various types of pollutants, resulting in difficult reclamation treatment. Reverse osmosis (RO) has been an important pollutant removal technology in the reclamation process of semiconductor industry wastewater, but membrane fouling has seriously affected its efficiency. In this paper, the types of the main pollutants in semiconductor industry wastewater are summarized, the main mechanism of the RO membrane fouling caused by the wastewater and the related control methods are introduced, and the fouling control strategies are proposed. Different processes of semiconductor production produce various types of wastewaters, including fluoride-contaminated water, phosphorus-contaminated water, ammonia-contaminated water, heavy metal contaminated water, organic wastewater, and acidic/alkaline wastewater. There are many types of pollutants in these wastewaters, their forms are complex, and their biodegradability is usually poor. Generally, different types of wastewaters are collected according to water quality. After corresponding pretreatment, some of the wastewaters is combined for further treatment and enter the RO system. Metal ions or fluoride ions in the wastewater are prone to forming inorganic scaling on the RO membranes, and surfactants tend to form organic fouling. RO membrane fouling caused by semiconductor wastewater can be controlled by pretreatment, membrane cleaning, and operating condition regulation. The typical treatment processes include ultrafiltration, EDTA cleaning, and pH regulation. However, most of the existing methods have limited efficiency. It is recommended that researchers develop targeted pretreatment technologies for key pollutants in the future. Moreover, combined with the semiconductor production process, an overall strategy for wastewater collection and reclamation treatment based on the key interaction of pollutants is proposed. 
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