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41.
Pulverization of waste printed circuit boards   总被引:1,自引:0,他引:1  
A new pulverization method to reduce the volume of waste printed circuit boards is reported. About 50% of printed circuit boards with integrate circuits (ICs) could be pulverized by our method in one 20-min batch, but boards without ICs could not be pulverized. By repeating the process three times, about 95% of printed circuit boards with ICs could be made into a fine powder with particles less than 106µm. A weight-drop test was also performed to examine the strength of the printed circuit boards and clarify the mechanism of pulverization. When a weight was dropped on the solder-welding side of the board ruptures occurred more easily than when the weight was dropped on the IC-mounted side. With a heavy weight, the IC was fractured more easily when the potential energy was low. Where the stress was concentrated, two types of rupture location were found on printed circuit boards with ICs. One was where the IC was connected to the printed circuit board. The other was where the surface had undulations. It also became clear that the fracture of printed circuit boards depends on the impacting weight rather than on the potential energy.  相似文献   
42.
The degradation of two kinds of polyion complex (PIC) fibers, chitosan-gellan (CGF), and poly(L-lysine)-gellan (LGF) fibers, by seven species of soil filamentous fungi has been investigated. All of the pure-line soil filamentous fungi, Aspergillus oryzae, Penicillium caseicolum, P. citrinum, Mucor sp., Rhizopus sp., Curvularia sp., and Cladosporium sp. grew on the two fiber materials. Microscopic observation of the biodegradation processes revealed that P. caseicolum on the CGF and LGF grew, along with the accompanying collapse of the fiber matrices. In the biochemical oxygen-demand (BOD) test, the biodegradation of the LGF by P. caseicolum and Curvularia sp. exceeded 97% carbon dioxide generation and the biodegradation of the CGF by A. oryzae was 59%. These results might offer some clues to the applications of the PIC fibers as environmentally biodegradable materials.  相似文献   
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