减压蒸馏耦合微电解处理六硝基二段洗水

通过对六硝基茋(HNS)生产过程中第二段工艺的产品洗涤废水进行水质分析,针对该段废水含有大量吡啶和多种溴代和硝基芳香类化合物的特点,探究了减压蒸馏耦合锌碳微电解法处理二段洗水的效果并优化工艺参数。结果显示,70℃条件下,二段洗水蒸馏至原体积的86.9%时,蒸馏剩余废水TOC去除率为44%,并且此前收集的馏分中吡啶浓度为10%～31.9%(V/V)。减压蒸馏工艺起到收集吡啶同时降低废水TOC的双重作用。减压蒸馏后,残留在废水中的有机物以溴代和硝基芳香化合物为主,采用微电解工艺,其条件优化实验的结果显示,在废水初始pH=1.0,锌投加量为25 g/L,锌碳投加比为1∶1,反应60 min后,废水TOC去除率为33%,采用多级微电解工艺可提高去除效果。     

Removing lead from metallic mixture of waste printed circuit boards by vacuum distillation: Factorial design and removal mechanism

The lead removal from the metallic mixture of waste printed circuit boards by vacuum distillation was optimized using experimental design, and a mathematical model was established to elucidate the removal mechanism. The variables studied in lead evaporation consisted of the chamber pressure, heating temperature, heating time, particle size and initial mass. The low-level chamber pressure was fixed at 0.1 Pa as the operation pressure. The application of two-level factorial design generated a first-order polynomial that agreed well with the data for evaporation efficiency of lead. The heating temperature and heating time exhibited significant effects on the efficiency, which was validated by means of the copper–lead mixture experiments. The optimized operating conditions within the region studied were the chamber pressure of 0.1 Pa, heating temperature of 1023 K and heating time of 120 min. After the conditions were employed to remove lead from the metallic mixture of waste printed circuit boards, the efficiency was 99.97%. The mechanism of the effects was elucidated by mathematical modeling that deals with evaporation, mass transfer and condensation, and can be applied to a wider range of metal removal by vacuum distillation.