氧掺杂g-C3N4光催化降解Cu-EDTA络合物的反应机理研究

本研究以Cu-EDTA为模拟污染物,探讨了非金属石墨相氮化碳(g-C_3N_4)在光催化降解重金属络合污染物中的应用潜力.首先采用在空气气氛下煅烧的方式对g-C_3N_4进行氧掺杂改性,并通过XRD、TEM和DRS等表征手段对掺杂前后的催化剂结构进行表征.光催化性能评价结果表明,氧掺杂改性更有利于催化剂表面光生空穴的分离,从而呈现出显著提升的破络合能力.通过自由基猝灭实验对g-C_3N_4光降解Cu-EDTA的催化机制进行了研究,结果表明,未掺杂g-C_3N_4通过O_2~(·-)、空穴和·OH的共同作用实现重金属络合物的去除,而氧掺杂样品以具有更强破络合能力的光生空穴为主要活性物种实现Cu-EDTA污染物的降解.     

Enhanced photoelectrocatalytic decomplexation of Ni-EDTA and simultaneous recovery of metallic nickel via TiO2/Ni-Sb-SnO2 bifunctional photoanode and activated carbon fiber cathode

In order to enhance Ni-EDTA decomplexation and Ni recovery via photoelectrocatalytic (PEC) process, TiO₂/Ni-Sb-SnO₂ bifunctional electrode was fabricated as the photoanode and activated carbon fiber (ACF) was introduced as the cathode. At a cell voltage of 3.5 V and initial solution pH of 6.3, the TiO₂/Ni-Sb-SnO₂ bifunctional photoanode exhibited a synergetic effect on the decomplexation of Ni-EDTA with the pseudo-first-order rate constant of 0.01068 min⁻¹ with 180 min by using stainless steel (SS) cathode, which was 1.5 and 2.4 times higher than that of TiO₂ photoanode and Ni-Sb-SnO₂ anode, respectively. Moreover, both the efficiencies of Ni-EDTA decomplexation and Ni recovery were improved to 98% from 86% and 73% from 41% after replacing SS cathode with ACF cathode, respectively. Influencing factors on Ni-EDTA decomplexation and Ni recovery were investigated and the efficiencies were favored at acidic condition, higher cell voltage and lower initial Ni-EDTA concentration. Ni-EDTA was mainly decomposed via ·OH radicals which generated via the interaction of O₃, H₂O₂, and UV irradiation in the contrasted PEC system. Then, the liberated Ni²⁺ ions which liberated from Ni-EDTA decomplexation were eventually reduced to metallic Ni on the ACF cathode surface. Finally, the stability of the constructed PEC system on Ni-EDTA decomplexation and Ni recovery was exhibited.     

UV/氯降解铜络合物的特性与机理

本研究选取Cu-EDTA、Cu-NTA、Cu-柠檬酸和Cu-酒石酸4种典型的铜络合物来探讨UV/氯工艺在酸性和中性条件下降解重金属络合污染物的潜力,并以Cu-EDTA为代表物详细考察了[NaClO]_0/[Cu]_0(物质的量比)、初始溶液pH值和NO~-_3、SO■等共存物质对UV/氯破络性能的影响.结果表明,UV/氯对多种铜络合物具有高效的氧化破络能力,可将Cu浓度从初始的19.2 mg·L~(-1)降至1.0 mg·L~(-1)以下.在[NaClO]_0/[Cu]_0为60、初始溶液pH为3.0～5.0的条件下, UV/氯对Cu-EDTA的破络效果较好,Cu和TOC的去除率分别高于95%和70%,但共存的NO~-_3、SO■、Ca~(2+)和NOM对Cu-EDTA的破络有一定抑制作用.自由基捕获实验和竞争动力学研究结果表明,UV/氯通过HO·和Cl·两者的共同作用实现Cu-EDTA破络,在pH=5.0时的贡献分别为60%和40%.产物鉴定结果证明,Cu-EDTA降解为N—C键逐步断裂的脱羧过程,其中,—N—(CH_2—COOH)_2和—N—CH_2—CH_2—N—基团上的N—C键断开生成Cu-ED3A和Cu-NTA,分别贡献约80%和20%.UV/氯对实际络合铜废水仍具有良好的处理效果,Cu浓度由初始的20.4 mg·L~(-1)降至约1.0 mg·L~(-1).