Decomposition of poly(amide-imide) film enameled on solid copper wire using atmospheric pressure non-equilibrium plasma

The decomposition of a poly(amide-imide) thin film coated on a solid copper wire was attempted using atmospheric pressure non-equilibrium plasma. The plasma was produced by applying microwave power to an electrically conductive material in a gas mixture of argon, oxygen, and hydrogen. The poly(amide-imide) thin film was easily decomposed by argon-oxygen mixed gas plasma and an oxidized copper surface was obtained. The reduction of the oxidized surface with argon-hydrogen mixed gas plasma rapidly yielded a metallic copper surface. A continuous plasma heat-treatment process using a combination of both the argon-oxygen plasma and argon-hydrogen plasma was found to be suitable for the decomposition of the poly(amide-imide) thin film coated on the solid copper wire.     

Development of an environmentally acceptable volatile organic compounds recovery and reuse system based on vacuum spray flash with dibasic acid esters as absorbents

We used dibasic acid esters as the absorbent for a volatile organic compounds (VOC) recovery and reuse system geared mainly toward VOCs from painting and presswork. The system consists of three elements: absorption using dibasic acid esters, separation by vacuum spray flash method, and recovery by condensation. The concentration of both ethyl acetate (EtAc) and isopropyl alcohol (IPA) decreased around 90% at room temperature. Vacuum spray flash was found as a useful process for cost-effective and energy-effective VOC removal system. The difference in the dissolubility parameters (Hansen constant) between dibasic acid esters and VOCs and the boiling point of VOCs was the main contributor to the separation behavior.     

Hydrodynamic forces on emergent cylinders in non-uniform flow

Environmental Fluid Mechanics - The main objective of conducting numerical simulations of flows in rivers with vegetation is to investigate the complex flow dynamics involved in non-equilibrium...