电驱动功率模块微纳米尺度加工新技术及应用

电驱动功率模块能够采用的一种微纳米尺度加工新技术是聚焦离子束,该技术对半导体器件能够进行微区溅射与增强刻蚀,能够在分辨率优于0.1 nm条件下对样品特定微区进行无需掩模的精确刻蚀;能够对样品表面进行薄膜沉积,便于裸芯片截面加工、导电性差或不导电样品的SEM形貌观察;能够进行裸芯片截面加工及观察,有效结合裸芯片截面研磨工艺实现三代半导体材料工艺器件截面加工技术的全覆盖;能够进行半导体材料改性及器件研制,具有无需掩模版和感光胶层并简化工艺流程等优点。     

磁溅射法制备TiO2/PTFE复合膜及其性能研究

目的研究磁控溅射法在聚四氟乙烯(PTFE)微孔膜上负载TiO_2,制备TiO_2/PTFE复合膜。方法利用接触角、扫描电子显微镜(SEM)、X射线光电子能谱(XPS)、拉伸强度等对复合膜亲水性、元素、形貌和机械强度进行测试,通过控制变量法研究了溅射时间、溅射功率对膜性能的影响及对复合膜对甲基橙的降解性能。结果在溅射功率为40 W,溅射时间为90 s时,TiO_2/PTFE复合膜的亲水性和拉伸强度相对较好,甲基橙的去除率达97%,降解效果好。结论通过实验可以优化出磁控溅射的工艺参数,制备出物理性能优异,并具有较高的光催化活性的负载型纳米催化剂。     

粉末溅射SnO2／SnO2：Pt双层膜对CO的气敏特性

本文介绍了一种新型结构ＣＯ敏的半导体薄膜材料－粉末溅射方法制备的表面层掺杂ＳｎＯ２／ＳｎＯ２：Ｐｔ双层膜的气敏特性。分析了双层膜中的导电层厚度对气敏特性的影响，并对气敏机是的有关问题进行了讨论。     

一种新型CO气敏双层薄膜材料

介绍了一种新型结构 CO气敏的半导体薄膜材料——粉末溅射方法制备的表面层掺杂 Sn O2 /Sn O2 ∶ Pt双层膜的气敏特性。分析了双层膜中的导电层厚度对气敏特性的影响 ,并对气敏机理的有关问题进行了讨论     

NiTi形状记忆合金的加工方法

对NiTi形状记忆合金的多种加工方法如锻造、热挤压、轧制和拉拔、冷加工、粉末成形、包套碎片挤压成形、溅射沉积加工等进行了详细介绍。     

粉末冶金高纯铬和铬合金溅射靶材烧结工艺研究

介绍了不同加工方式对铬靶烧结密度的影响。在机压过程中,采用双向压制,不添任何成型剂和脱氧剂。机压+真空烧结铬环靶材密度为78%～80%;冷等静压+真空烧结铬板靶材密度大于82%;而经轧制后,铬板靶材密度提高到90%～95%;铬合金靶材采用热压方式,其密度大于98%。通过优化烧结时间和烧结温度等工艺参数,铬环靶材的烧结成本大大降低。     

Groundwater remediation engineering--Study on the flow distribution of air sparging using acetylene

Air sparging(AS) is an emerging method to remove VOCs from saturated soils and groundwater. Air sparging performance highly depends on the air distribution resulting in the aquifer. In order to study gas flow characterization, a two-dimensional experimental chamber was designed and installed. In addition, the method by using acetylene as the tracer to directly image the gas distribution results of AS process has been put forward. Experiments were performed with different injected gas flow rates. The gas flow patterns were found to depend significantly on the injected gas flow rate, and the characterization of gas flow distributions in porous media was very different from the acetylene tracing study. Lower and higher gas flow rates generally yield more irregular in shape and less effective gas distributions.