离子液体对废旧印刷线路板中铜、锌、铅的浸出规律

以离子液体1-丁基磺酸-3-甲基咪唑三氟甲烷磺酸盐(BSO_3HMIm]OTf)为浸出剂,初步研究了WPCBs浸铜过程中锌和铅浸出率的影响因素。实验结果表明:铜、锌的浸出率随着WPCBs粒径的减小、H_2O_2溶液加入量的增大而增大,铜的浸出率随浸出温度的升高先增大后减小,锌的浸出率受浸出温度影响不大;铅的浸出率受5种因素影响不大,且总体处于较低水平。在WPCBs粒径为0.100~0.250 mm、离子液体加入量为60.0%(φ)、H_2O_2溶液加入量为7.5%(φ)、固液比为1∶15、浸出温度为50℃的条件下,铜、锌、铅的浸出率分别为99.84%,93.25%,22.46%。

Leaching rule of copper,zinc,lead from waste printed circuit board by ionic liquid

The effects on lead and zinc leaching in the process of copper leaching from waste printed circuit boards（WPCBs）by ionic liquid BSO₃HMIm]OTf were investigated. The experimental results showed that：The leaching rate of copper,zinc was increased with the decrease of WPCBs particle size,solid-liquid ratio and the increase of H₂O₂ solution amount,ionic liquid amount;The copper leaching rate was inceased firstly and then decreased with the increase of leaching temperature,whilc the zine leaching rate was slightly affected by leaching temperature;The lead leaching rate was slightly affected by the 5 factors and was always at a low level;Under the conditions of WPCBs particle size 0.100-0.250 mm,ionic liquid amount 60.0%（φ）,H₂O₂ solution amount 7.5%（φ）,solid-liquid ratio 1∶5 and leaching temperature 50 ℃,the leaching rate of copper,zinc,lead was 99.84%,93.25%,22.46%,respectively.