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多层陶瓷电容器应用与可靠性研究
引用本文:彭浩,席善斌,裴选,高兆丰,黄杰.多层陶瓷电容器应用与可靠性研究[J].环境技术,2016(2):21-25.
作者姓名:彭浩  席善斌  裴选  高兆丰  黄杰
作者单位:中国电子科技集团公司第十三研究所,石家庄 050051; 国家半导体器件质量监督检验中心,石家庄 050051
摘    要:多层陶瓷电容器(MLCC)在使用过程中电参数会发生不同程度的退化甚至超差失效,降低了其可靠性。引起失效的原因可分为损耗性失效、过应力失效、内部缺陷失效以及外部缺陷失效四类。基于日常失效分析工作中遇到的多层陶瓷电容器失效问题,结合国内外文献调研资料,首先对多层陶瓷电容器制造工艺进行了分析,然后对烧结裂纹、分层及空洞三种内在缺陷以及使用过程中外部应力引起的装配裂纹、热应力裂纹、弯曲裂纹、银迁移等失效模式及其相应的微观失效机理展开了深入讨论,最后对上述失效提出了相应建议和预防措施。

关 键 词:多层陶瓷电容器  制造工艺  失效分析  微观机理

Applications and Reliability Study of MLCCs
Abstract:The electrical parameters of multilayer ceramic capacitor (MLCC) will be degraded or become to failure severely in the actual application, so the reliability will be degraded too. The cause of the failure can be divided into four parts: wearout failure, overstress failure, intrinsic defects and extrinsic defects. Based on the failure analysis of multilayer ceramic capacitors and the literatures reported home and domestic for reference, the manufacturing process of multilayer ceramic capacitor is analyzed firstly. Then, the failure mechanism of three kinds of intrinsic defects such as firing crack, delamination and void, as well as the handing cracks, thermal cracks, flex cracks and silver migration caused by extrinsic stress is discussed in detail. Finally, the corresponding suggestions and preventive measures of the failure are put forward.
Keywords:MLCC  fabrication process  failure analysis  microcosmic mechanism
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