| 基于温度循环的ALT技术在电子产品中的应用 |
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| 引用本文： | 李树桢,李晓阳,姜同敏,刘炯军.基于温度循环的ALT技术在电子产品中的应用[J].装备环境工程,2009,6(6):73-77. |
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| 作者姓名： | 李树桢 李晓阳 姜同敏 刘炯军 |
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| 作者单位： | 1. 北京航空航天大学,北京,100191
2. 摩托罗拉,中国,技术有限公司,北京,100102 |
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| 摘 要： | 为了缩短ALT试验时间，从而提高其工程适用性，提出了一种针对电子产品，基于温度循环的加速寿命试验方法。该方法通过分析产品的失效模式确定激发应力，根据相似产品的历史经验数据建立现场使用年数与研制阶段试验时间之间的回归关系，选择加速因子，从而确定试验时间和试验剖面；这种方法可以在比常规ALT更短的时间内考查产品研制阶段可靠性水平，利用x2分布评估产品的可靠性指标平均寿命θ。最后，以电源产品的工程实例验证了其工程实用性。
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| 关 键 词： | 加速寿命试验(ALT) 温度循环 电子产品 可靠性 平均寿命 |
Application of Temperature Cycle Based ALT Technology in Electronic Products |
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| Institution: | LI Shu-zhen, LI Xiao-yang, JIANG Tong-min, LIU Jiong-jun ( 1. Beijing University of Aeronautics and Astronautics, Beijing 100191, China; 2. Motorola(China)Technology Corporation Ltd, Beijing 100102, China) |
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| Abstract: | In order to shorten testing time of ALT and enhance its application in engineering,this paper recommended a new approach to conduct ALT for electronic products based on temperature cycle. Accelerated factor and test profile were determined through analyzing product＇ s failure modes and excitation stresses, and according to similar products＇ experience data to establish the regression relation between field usage years and testing time in development phase. With this method, reliability can be verified in less time than conventional ALT, and reliability measurements such as average life can be evaluated using Chi-Square. At last, an engineering example of a power supply was presented to demonstrate the practicality of this approach. |
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| Keywords: | accelerated life test temperature cycle electronic product reliability average life |
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