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A study on recovery of SiC from silicon wafer cutting slurry
Authors:Lee  Wei-Hao  Hsu  Chih-Wei  Ding  Yung-Chin  Cheng  Ta-Wui
Institution:1.Institute of Mineral Resources Engineering, National Taipei University of Technology, Taipei, Taiwan, Republic of China
;2.GlobalWafers Co., Ltd., Hsinchu, Taiwan, Republic of China
;
Abstract:Journal of Material Cycles and Waste Management - The objective of this study is to recover SiC from silicon wafer cutting slurry using physical separation and acid/alkali purification processes....
Keywords:
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