工业余热拆卸废旧电路板

电路板插槽元器件、通孔元器件、大元器件和小元器件的拆卸是废旧电路板资源化的第一步。前三者的拆卸率对后续的电路板粉碎有较大影响，是决定拆卸效果的重要参数。为探究工业余热拆卸废旧电路板方法中通气温度、加热时间和喷吹次数对元器件拆卸率的影响，找出最优的拆卸参数组合，进行了废旧电路板拆卸的正交实验。对元器件拆卸率、关键元器件总拆卸率的极差分析和方差分析表明，通气温度和加热时间的增大有利于元器件拆卸率增大；增加喷吹次数，有利于大元器件和小元器件的拆卸，但过多次数喷吹将造成插槽、通孔元器件引脚弯曲，拆卸率减小；通气温度、加热时间对元器件拆卸的影响不具显著性，喷吹次数仅对大元器件拆卸有显著性影响。综合分析关键元器件的拆卸率：通气温度350℃、加热时间5 min和喷吹6次是最优的拆卸参数组合，关键元器件总拆卸率达到98.6%。

Waste printed circuit boards(WPCBs) disassembly using industrial exhaust heat

Disassembly of slot components, through-hole components, large components, and small components on waste printed circuit boards (WPCBs) is the first step of WPCB recycling. The disassembly rates of the first three components have a great impact on circuit board crushing; they are important parameters that determine the effect of disassembly. Orthogonal experiments of WPCBs were carried out to research the effect of air temperature, heating time, and the number of blowing periods on the disassembly of WPCBs using industrial exhaust heat, and to define the optimal combination of parameters. Range analysis and variance analysis were used to analyze the disassembly rates of components and the total disassembly rates of key components. These analyses revealed the following results. Increasing the air temperature and heating time were helpful for increasing the disassembly rates of electronic components. Increasing the number of blowing periods increased the disassembly rates of both large and small components, while too many blowing periods caused bending of the pins of slot and through-hole components, and decreased the disassembly rates. Air temperature and heating time had no significant effect on the disassembly rates of electronic components, while the number of blowing periods had a significant impact on the disassembly rate for large components only. The comprehensive analysis of key components disassembly rates demonstrated that an air temperature of 350℃, 5 minutes of heating, and 6 blowing periods were the optimal combination of parameters, resulting in a total disassembly rate of key components of 98.6%.