电子封装行业职业有害因素的辨识与分析

从电子封装行业工艺入手,依据国家颁布的职业有害因素分类目录及职业有害因素致病模型,针对电子封装行业插入式(DIP)及表面贴装(QFP/SOIC)制造工艺使用的材料、设备、条件、人员作业特点,对行业内具有共性的职业有害因素进行分析,对工艺过程中存在的职业有害因素作出辨识,并提出把硅粉尘、铅、氩气、高温、环氧树脂、氢氧化钾、噪声、酸雾、重复性静态作业、重复性动态作业等有害因素作为防控重点,为电子封装行业职业有害因素的危害量化评价及其防控措施制定提供了科学依据。

Occupational Hazards Identification and Analysis in Electronic Assembly Industry

Based on the occupational hazards classification lists and occupational disease causation models issued by China,the occupational hazards existing in the electronic assembly industry are analyzed and identified according to the features of materials,equipment and staffs in DIP and QFP/SOIC production process.It is suggested that emphasis should be put on the prevention and control of silicon or silicon dioxide dusts,lead,argon gas,high temperature,epoxy resin,potassium hydroxide,noise,acid mist,repeatable static work and dynamic work.This study provides basic support for the quantitative risk assessment of occupational hazards and the establishment of occupational hazard protection measures in the electronic assembly industry.