印制电路板组件“三防”试验失效分析与案例

通过"三防"试验分析与案例,提高三防设计或工艺的科学性、合理性。本文阐述了湿热、盐雾、霉菌试验失效主要原因与案例,本文阐述了影响聚对二甲苯气相沉积涂敷,镀覆,液态涂料涂敷,应力筛选,密封等试验失效因素,从试验方法、工艺控制、材抖选择等诸多方面进行分析,探讨"避免"失效的措施。

Research on Shipborne Print Circuit Module's "NBC Defense" Technology

This paper analyzes the ＂three defenses＇ trials and cases to improve the ＂three defenses＂ process more scientific and more rational. Specifically, it analyzes the hot and humid, salt spray, mold as well as other ＂three defenses＂ main reason for test failure; and discusses the factors of failure reasons which include gathers xylene gas phase deposition painting, plates duplicating, liquid state coating painting, stress screening, seal.Then it attempt to propose the measures and methods avoiding failure by discussing from the test methods, process control, material selection and many other aspects of buffeting.