硝酸浸提拆解废印制电路板元器件技术

研究了废印制电路板在不同浓度硝酸溶液中焊锡完全溶解的时间，以及Sn，Pb，Zn，Fe和Cu的溶解规律及循环利用浸提液的可行性. 结果表明:废印制电路板最佳剥离硝酸浓度为2 mol/L左右，该条件下210 min内废印制电路板上的焊锡完全溶解，元器件能够全部拆除；稀硝酸作为浸提液，可重复利用4次以上，各次循环对焊锡均具有较好的溶解效果；循环利用过程中，Cu反应速率逐次增加，易造成Cu的流失. 

A Technology for Disassembling Electronic Components from Waste Printed Circuit Boards Using Nitric Acid as Leaching Liquor

The complete dissolving time of solder and the dissolving rules of Sn, Pb, Zn, Fe, and Cu in waste printed circuit boards (PCB) in different concentrations of nitric acid as leaching liquor, along with the feasibility of recycling the leaching liquor, were investigated in this paper. The results reveal that the best nitric acid concentration is about 2 mol/L, in which the solder in the waste PCB can be completely dissolved and the electronic components can be completely disassembled in 210 mins. The leaching liquor can be reused more than four times with each time having a good dissolving capacity. However, during the process of recycling the leaching liquor, the reaction speed of Cu increases each time, which easily leads to the loss of Cu.