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老化试验中温度变化问题探讨
引用本文:冯建,胡波,邢宗锋,罗俊.老化试验中温度变化问题探讨[J].环境技术,2014(5):13-16.
作者姓名:冯建  胡波  邢宗锋  罗俊
作者单位:中国电子科技集团公司第二十四研究所,重庆,400060
摘    要:介绍了烘箱老化环境温度受电路功率,老化板摆放位置的变化、烘箱风速变化等因素的影响导致烘箱内温场出现变化,烘箱内温场变化剧烈的会影响产品的正常老化,形成过应力的情况,严重时会造成电路失效。对影响烘箱温度的因素进行了试验监控分析,找出了影响烘箱温场的主要原因和规律,防止老化电路过温失效。

关 键 词:电路功率  烘箱温场  功率器件  耗散功率

Discussion on Temperature Variation During Burn-in Testing
FENG Jian,HU Bo,XING Zong-feng,LUO Jun.Discussion on Temperature Variation During Burn-in Testing[J].Environmental Technology,2014(5):13-16.
Authors:FENG Jian  HU Bo  XING Zong-feng  LUO Jun
Institution:(Sichuan Institute of Solid State Circuits, China Electronics Technology Group Crop., Chongqing 400060)
Abstract:This paper introduces the chamber temperature distribution of burn-in oven affected by the varying of burn-in boards’ position and the fans’ rev, etc.. The rapid temperature changes in oven affects the normal burn-in seriously and form the over-stress condition, seriously, it leads to circuit malfunction. We monitored and analyzed the factors that affect the chamber temperature distribution of oven in tests, and found out the main factors and regularity that affect the field temperature distribution of burn-in oven, it can effectively prevent over-temperature failure of aging circuit.
Keywords:power dissipation of circuit  temperature field of oven  power device  dissipation power
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