| 温度循环对键合及芯片烧结性能的影响分析 |
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| 引用本文： | 张锋,谭骁洪.温度循环对键合及芯片烧结性能的影响分析[J].环境技术,2014(5):41-43. |
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| 作者姓名： | 张锋 谭骁洪 |
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| 作者单位： | 中国电子科技集团公司第24研究所,重庆,400060 |
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| 摘 要： | 温度循环针对材料间的热胀冷缩特性，产生蠕动和疲劳损伤效应。半导体器件在温度循环试验过程中封装可靠性随温度循环时间逐步退化。针对一种半导体器件的键合强度、芯片剪切强度、芯片烧结空洞随温度循环次数的退化情况进行了分析。
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| 关 键 词： | 温度循环 键合强度 剪切强度 空洞 |
Analysis on the Inlfuence of Characters of Bonding and Adhesive in Temperature Cycle Test |
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| ZHANG Feng,TAN Xiao-hong.Analysis on the Inlfuence of Characters of Bonding and Adhesive in Temperature Cycle Test[J].Environmental Technology,2014(5):41-43. |
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| Authors: | ZHANG Feng TAN Xiao-hong |
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| Institution: | (Sichuan Institute of Solid-State Circuits, China Electronics Technology Group Corporation, Chongqing 400060) |
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| Abstract: | Depending on behavior of cold shrink and thermal expansion, temperature cycle can accrue peristalsis effect and fatigue-damage effect. Packaging dependability bechance performance degradation in temperature cycle. The paper analyzes performance degradation of bonding strength and shear strength and adhesive void by temperature cycle index. |
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| Keywords: | temperature cycle bonding strength shear strength void |
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