加压氨浸法选择性回收废线路板中的铜、锌和镍

以氨水-铵盐缓冲溶液作为浸出试剂,氧气作为氧化剂,在高压釜中通过加压氨浸法回收废弃印刷线路板中的铜、锌和镍,分别研究了浸出时间、氨水浓度、铵盐浓度、搅拌速率、氧气压力、温度和不同种类铵盐对浸出效果的影响,并得到浸出的最优工艺条件:铵盐选择碳酸铵浸出效果最佳,浓度为1 mol/L,氨水浓度为4 mol/L,搅拌速率为70...

Selective Recovery of Copper,Zinc and Nickel from Printed Circuit Boards by Ammonia Leaching Under Pressure

The ammonia/ammonium leaching process using oxygen as oxidant in autoclave was studied to extract copper, zinc and nickel from printed circuit board. Parameters such as leaching time, concentration of leaching reagents, stirring speed, oxygen pressure and temperature were optimized. The best results were achieved when the leaching was carried out at 55 degrees C for 150 minutes, using 4 mol/L NH4OH and 1 mol/L (NH4)2CO3 as leaching solution, with 700 r/min stirring speed and 0.2 MPa oxygen. With this method, Zn, Cu and Ni could be effectively recovered from printed circuit boards by 100%, more than 99% and more than 64%, respectively. The kinetics of Cu leaching behavior was studied and it was found that the shrinking core model described it well. It was a diffusion control process and the apparent activation energy was 14.68 kJ/mol.