| 流动镀Ni-P合金镀层工艺的研究 |
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| 引用本文： | 于文忠,俞宏英,王玉,孙冬柏,孟惠民,樊自栓.流动镀Ni-P合金镀层工艺的研究[J].装备环境工程,2007,4(3):77-80. |
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| 作者姓名： | 于文忠 俞宏英 王玉 孙冬柏 孟惠民 樊自栓 |
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| 作者单位： | 1. 北京科技大学,材料科学与工程学院,北京,100083
2. 北京科技大学,材料科学与工程学院,北京,100083;北京表面纳米技术工程研究中心,北京,100083 |
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| 基金项目： | 北京市教委科技发展计划基金重点项目 |
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| 摘 要： | 电沉积Ni-P合金镀层由于其优异的性能而在多个领域得到了广泛的应用;流动镀电沉积由于可以较快地提高电沉积速度而受到极大的关注;建立了镀液平行式流过电极表面的流动镀装置,采用该流动镀装置,通过改变电流密度、流速、电极间距等不同的工艺条件,研究了流动镀条件下,电流密度、流速、极间距对电沉积Ni-P合金镀层中P含量和表面形貌的影响规律,并初步探讨了流动镀条件下各工艺条件对电沉积过程的影响机理.
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| 关 键 词： | 流镀 Ni-P镀层 表面形貌 P含量 流动 合金镀层 镀层工艺 研究 Plating Process Flow Alloy 机理 电沉积过程 规律 影响 表面形貌 含量 电极间距 工艺条件 流速 电流密度 装置 电极表面 平行式 |
| 文章编号： | 1672-9242（2007）03-0077-04 |
| 修稿时间： | 2007-04-12 |
Study on Ni-P Alloy Flow Plating Process |
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| YU Wen-zhong,YU Hong-ying,WANG Yu,SUN Dong-bai,MENG Hui-ming,FAN Zi-shuan.Study on Ni-P Alloy Flow Plating Process[J].Equipment Environmental Engineering,2007,4(3):77-80. |
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| Authors: | YU Wen-zhong YU Hong-ying WANG Yu SUN Dong-bai MENG Hui-ming FAN Zi-shuan |
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| Institution: | 1. University of Science and Technology Beijing, Beijing 100083, China; 2. Beijing Engineering-Research Center for Surface Nano-Technology, Beijing 1000083, China |
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| Abstract: | Ni-P deposit was widely used in many fields due to its excellent properties. Flow plating was concentrated greatly as it can improve the deposition rate. Equipment of flow plating was set up in which the electrolyte flow over the surface of the electrodes parallelly. With this equipment, the influence of current density, flow rate of the electrolyte, electrode distance on the phosphorus, and content and morphology of the deposits was investigated by changing the different technology conditions. The effect mechanism of different technology factors on the course of electro-deposition was also discussed. |
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| Keywords: | flow plating Ni-P deposits surface morphology phosphorus content |
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