纳米碳孔金属化直接电镀技术

纳米碳直接电镀的出现对传统的PTH是个挑战，它最大的特点就是替代传统的化学镀铜工艺，利用物理作用形成的导电膜就可以直接进行电镀。工艺程序简便，减少了控制因素，与传统PTH制程相比，使用药品数量减少，生产周期大大缩短，生产效率大幅度提高，环境友好，污水处理费用减少，使印制电路板制造的总成本降低。

Direct Plating Technology for PTH Nano-carbon

The emergence of nano-carbon direct plating is a challenge to traditional PTH. The characteristic of nano-carbon direct plating is that substitute traditional chemical copper plating and direct plating through conductive film formed by physical effect. The process of nano-carbon direct plating is simplified; controlling factors of the process are reduced; chemical reagents used are less compared with traditional PTH. The process has the advantages of shorter production circle, greatly improved production efficiency, environment friendly, and less waste water treatment costs, which reduces total printed circuit board manufacturing costs.