中空玻璃微珠/氮化硼填充硅橡胶复合材料的介电、导热和阻燃性能研究

为满足5G电子封装材料的性能需求,将一定量的改性中空玻璃微珠(f-HGM)和氮化硼(f-BN)添加进加成型液体硅橡胶中制备了低介电、高导热且阻燃的硅橡胶复合材料。测试结果表明,添加了10份f-HGM和15份f-BN的复合材料的介电常数为2.68,介电损耗为0.008 16,显著低于纯硅橡胶,热导率为0.518 W/m·K,是纯硅橡胶的2.25倍。此外,复合材料的热稳定性得到了提升,pHRR和THR分别下降了55.3%和37.7%。通过气相和凝聚相分析发现,复合材料的气相热解产物浓度大幅降低,残炭的致密性和连续性得到显著提升。

Dielectric, thermal conductivity and flame retardant properties of hollow glass microspheres/boron nitride filled silicone rubber composites

To meet the performance requirements of 5G electronic packaging material, a certain amount of functionalized hollow glass microspheres (f-HGM) and boron nitride (f-BN) were added into the addition-cure liquid silicone rubber to prepare flame retardant silicone rubber composites with low dielectric constant and high thermal conductivity. The test results showed that the dielectric constant and loss of SR/f-HGM10/f-BN15 composite were 2.68 and 0.008 16, respectively, which were significantly lower than those of pure silicone rubber, and the thermal conductivity of the composite was 0.518 W/m K, which was 2.25 times as high as pure silicone rubber. In addition, the thermal stability of the composite was improved, and the PHRR and THR values decreased by 55.3% and 37.7%, respectively. The gas and condensed phase analysis results showed that the gaseous pyrolysis products of the composite were greatly reduced, and the compactness and continuity of the carbon residue were significantly improved.