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羟基乙叉二膦酸镀铜废液的处理及Cu~(2+)的高附加值资源化回收
引用本文:王洋洋,张振忠,武杨,赵芳霞.羟基乙叉二膦酸镀铜废液的处理及Cu~(2+)的高附加值资源化回收[J].化工环保,2017,37(6):699-702.
作者姓名:王洋洋  张振忠  武杨  赵芳霞
作者单位:南京工业大学 材料科学与工程学院,江苏 南京 210009
基金项目:江苏高校优势学科建设工程项目(苏政办发2011-6); 广西科技成果转化与推广计划项目(1298009-15)
摘    要:采用Na BH4还原法将羟基乙叉二膦酸(HEDP)镀铜废液中的Cu~(2+)制备成纳米铜粉,并采用聚丙烯酰胺(PAM)对还原反应后的废液进行絮凝处理。研究了n(Cu~(2+))∶n(Na BH4)、还原反应温度、还原反应时间及PAM添加量对废液中剩余Cu~(2+)质量浓度的影响,并对回收的纳米铜粉进行了XRD和TEM表征。实验结果表明:当n(Cu~(2+))∶n(Na BH4)=4∶6、还原反应温度为50℃、还原反应时间为2 h时,废液中剩余Cu~(2+)质量浓度降低至1.1 mg/L,Cu~(2+)还原率达99.99%;可获得粒径为20~45 nm的近球型、高纯度、由多晶组成的纳米铜粉;当PAM添加量为10 mg/L时,废液中剩余Cu~(2+)质量浓度降至0.35 mg/L以下,达到GB 21900—2008《电镀污染物排放标准》(小于0.5 mg/L)的要求。

关 键 词:羟基乙叉二膦酸  镀铜废液  硼氢化钠  还原  纳米铜粉  聚丙烯酰胺  絮凝  资源化利用  
收稿时间:2017-02-24

Treatment of HEDP copper plating effluent and recovery of Cu2+ with high added value
Wang Yangyang,Zhang Zhenzhong,Wu Yang,Zhao Fangxia.Treatment of HEDP copper plating effluent and recovery of Cu2+ with high added value[J].Environmental Protection of Chemical Industry,2017,37(6):699-702.
Authors:Wang Yangyang  Zhang Zhenzhong  Wu Yang  Zhao Fangxia
Institution:College of Materials Science & Engineering,Nanjing Tech University,Nanjing 210009,Nanjing Jiangsu 210009,China
Abstract:Cu2+ was recoved from the HEDP copper plating effluent by NaBH4 reduction method to prepare copper nanoparticle. The wastewater after reduction reaction was further treated by polyacrylamide(PAM)flocculant. The effects of n(Cu2+):n(NaBH4),reduction reaction temperature,reduction reaction time and PAM amount on the residual Cu2+mass concentration of the wastewater was studied,and the prepared copper nanoparticles were characterized by XRD and TEM. The experimental results showed that:Under the conditions of n(Cu2+):n(NaBH4)= 4:6,reduction reaction temperature 50 ℃ and reduction reaction time 2 h,the residual Cu2+ mass concentration of the wastewater was dropped below 1.1 mg/L,the Cu2+ reduction rate was 99.99%;The obtained copper nanoparticles were high-purity spheroidal powders with 20-45 nm of size and consisted of polycrystals;When the PAM addition was 10 mg/L,the residual Cu2+ mass concentration of the wastewater was decreased to below 0.35 mg/L,which met the national discharge standard of GB 21900-2008(less than 0.5 mg/L).
Keywords:1-hydroxy ethylidene-1  1-diphosphonic acid(HEDP)  copper plating effluent  NaBH4  reduction  copper nanoparticle  polyacrylamide(PAM)  flocculation  resource utilization  
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