| 废弃电路板SMD元件热拆除工艺实验研究 |
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| 引用本文： | 刘丹.废弃电路板SMD元件热拆除工艺实验研究[J].再生资源与循环经济,2011,4(8):37-40. |
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| 作者姓名： | 刘丹 |
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| 作者单位： | 湖南商务职业技术学院,湖南长沙,410205 |
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| 摘 要： | 废弃电路板元件的分离,一直是废弃电路板回收利用的难点。利用有限元分析软件ANSYS建立表面安装元器件(SMD)的有限元分析模型,通过对加热过程进行仿真,分析出元件分离的必要条件。
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| 关 键 词： | 废弃电路板 热拆除 工艺 实验研究 |
Experimental study on SMD components heat disassembly of waste PCB |
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| LIU Dan.Experimental study on SMD components heat disassembly of waste PCB[J].Recycling Research,2011,4(8):37-40. |
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| Authors: | LIU Dan |
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| Institution: | LIU Dan(Hunan Vocational College of Commerce,Changsha 410205,China) |
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| Abstract: | Component separation has been the difficulty for waste PCB recycling. In this paper, the finite element analysis software ANSYS was used to establish the finite element analysis model of the surface mount components （SMD）, by which the heating process was simulated, and the necessary conditions for components separation were given. |
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| Keywords: | PCB heat disassembly process experimental study |
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