从废蚀刻液中回收资源的应用研究

从电路板蚀刻液回收硫酸铜及制作再生蚀刻液进行了工艺探索 ,得出中和法可从蚀刻液中脱除约 90 %的铜 ,沉淀氢氧化铜的最佳pH值为 5 6～ 6 0。采用水合肼还原法与硫化钠沉淀法可进一步脱除蚀刻液中的铜。研究结果表明 ,水合肼还原法回收海绵铜 ,在pH值为 6 0 ,反应温度 4 0℃ ,水合肼的投加浓度为 3%时 ,铜的回收率达到了 98%以上。而硫化钠沉淀法可取得 99%以上脱除废液中的铜效果 ,且具有适应范围广 ,操作成本低的优势。进一步除铜后的废液可回用于制新蚀刻液

STUDY ON THE RECOVERY OF RESOURCE FROM SPENT ETCHING SOLUTION

The recovery of copper sulfate and making a regenerated etching solution from spent etching solution were studied.About 90% copper can be removed from the spent etching solution by neutralization.The optimum pH for Cu(OH) 2 settling was 5.6～6.0. For making the regenerated etching solution the copper can be removed further by hydrazine hydrate as reducing agent or sodium sulfide settling method.The experimental results showed the recovery rate of copper sponge can reach 98% when pH is 6.0,reaction temperature is 40 ℃ and the dosage of hydrazine hydrate is 3%.More than 99% copper can be removed by the sodium sulfide settling method.The sodium sulfide settling method has the advantage of cost-saving.