基于相关性分析的PCBA热力学模型修正

目的精确且高效地对印制电路板组件热力学模型进行修正。方法采用基于拉丁超立方抽样试验设计和Speraman等级相关系数计算公式的相关性分析方法,找出电子产品热仿真试验中对元器件表面温度值影响较大的输入参数,然后进一步分析得出输入与输出之间的函数关系。在此基础上给出印制电路板组件(PCBA)热力学模型修正的一般方法流程。最后利用该方法对某航空电子产品中一块PCBA的热力学模型进行修正。结果修正结果较精确且只调用2次有限元软件。结论该热模型修正方法具有较高的精确性和高效性,可推广用于工程实践。

Study on the Method of Thermodynamics Model Updating of Printed Circuit Board Assembly

Objective To update the thermodynamics model of the printed circuit board assembly accurately and efficiently. Methods The input parameters with great effects on the surface temperature of a component in the thermal simulation test were found out through the correlation analysis method which was based on the Latin hypercube sampling experiment design and the computational formula of Speraman rank correlation coefficient. And then the function relationship between the input and output was obtained after further analysis. On this basis, the general process of the thermodynamics model updating of the printed circuit board assembly was provided. Finally, the thermodynamics model of a PCBA from an aircraft electronic product was updated with this method. Results The result of the updated model showed good accuracy and only two calls to finite element software. Conclusion This method of thermodynamics model updating had good accuracy and efficiency, and could be used in engineering practice.