电子元器件表面化学防护效果的测定研究

目的研究电子元器件表面化学防护的方法。方法应用选择性涂覆设备进行研究并优化工艺条件,选择丙烯酸清漆和稀释剂的体积混合比例从1∶0.2到1∶1进行实验,在100 mm/s的喷涂速度下,喷涂印制板的过程在0.5 min内完成,喷涂的相对标准偏差不超过±0.005 mm。结果涂层厚度可控制在25~75μm的范围内,符合国际标准ICP-CC-830的要求,涂层具有较好的流平性,无气泡、针孔和絮状物,无雾化等。结论这种方法可以成功地应用于印制板上电子元器件表面的化学防护。该方法具有涂覆准确性高,有毒稀释剂消耗量低,涂覆效果好,经济环保等的特点。

Study on the Determination of Electronic Components Surface Chemical Protective Effect

Objective To study the method of surface chemical protection of electronic components. Methods Using conformal coating equipment to research and optimization of the process conditions. Mixing ratio of acrylic varnish and diluent were from 1：0.2 to 1：1, at the dispense speed of 100mm s-1,a complete process could be performed within 0.5 minute,with a relative standard deviation of less than ＆#177;0.005mm. Results The coating thickness can be controlled in the range of 25-75um,consistent with the requirements of international standard ICP-CC-830,the coating has good leveling property,no bubbles,pinhole and floc,no atomization. Conclusion This method can be successfully applied to the surface chemical protection of electronic components on the printed circuit board. The method has high accuracy,low consumption of toxic diluent,good coating effect,economy and environmental protection etc. characteristics.