SRV菌去除电镀废水中铜的研究

为探索新的铜废水处理方法，更有效地治理铜废水造成的环境污染，用微生物及电镜法对SRV菌去除电镀废水中铜进行了研究。研究了菌量、铜离子浓度、溶液的pH值、作用的温度和时间等因素对SRV菌去除溶液中铜离子的影响。在菌废比1:1的情况下，对铜浓度为246.8mg/L的废水去除率达99.12％。观察了SRV菌处理铜废水前、后的扫描电镜、超薄切片透射电镜，推测其去除机制为铜与SRV菌代谢产物反应生成沉淀或直接被吸附于菌体表面而去除。

Research of copper removal from electroplating wastewater by SRV bacteria

In order to seek new methods for treatment of wastewater containing copper ion and reduce the pollution caused by copper wastewater more effeciently,the copper removal from electroplating wastewater by SRV bacteria by means of microbiology and electron micrograph was studied with effects of contents of SRV bacteria , concentration of copper in solution, pH of copper solution ,reaction temperature and time etc. on copper removai from copper solution. The rate of copper removal from wastewater containging 246. 8mg/L copper can reach 99. 12/% with the volume ratio of SRV bacteria to wastewater being 1 : 1 ;and satisfied result has been obtained while treating large amount of electroplating copper wastewater. According to observations of scanning electron micrograph and transmission electron micrograph before and after treatment, the assumed mechanism of copper removal by SRV bacteria may be that copper ion reacts with the metabolic product of SRV bacteria and the precipitate would be adsorpted directly on the surface of SRV bacteria.