废旧电路板热解油合成酚醛树脂胶粘剂的研究

研究了废旧电路板热解油代替苯酚合成酚醛树脂胶粘剂,采用L(93)4正交设计安排实验,重点考察了甲醛加入量、催化剂加入量,第一阶段反应温度和第二阶段反应温度四个因素对热解油酚醛树脂粘胶剂的胶合强度影响。依据正交试验结果和兼顾粘胶剂的整体性能,当热解油的加入量为35g时,合成酚醛树脂胶粘剂最优工艺为37wt%的甲醛加入量为47g,40wt%的氢氧化钠液加入量为7.8g,第一阶段温度为60℃,第二阶段温度为90℃。制得的酚醛树脂胶固含量,粘度和pH值适中,游离甲醛含量低于0.3wt%,符合GB/T14732-2006中规定的层压材料用酚醛树脂产品的相关标准和要求,并且其胶合强度符合GB/T9846-2004中由桦木制成的Ⅰ类胶合板胶合强度指标值(≥0.8MPa)。同时还对热解油和合成产物进行了高效液相色谱(HPLC),红外光谱分析(FTIR)分析,探求了反应变化的机理。由于废旧电路板热解油代替苯酚合成酚醛树脂胶粘剂降低了胶粘剂的生产成本,其所制得的胶粘剂有良好的应用前景。

Preparing Phenol-formaldehyde Resin Adhesive from Waste Printed Circuit Boards

Phenol-formaldehyde resin adhesive was prepared by reaction of formaldehyde and pyrolytic oil instead of pure phenol. An orthogonal experiment was performed to investigate the impact of factors such as amount of formaldehyde, amount of catalyst and temperature of the first stage and second stage on bond strength. According to results of orthogonal test and whole performance of phenol-formaldehyde resin adhesive, a reasonable synthetic process was proposed with pyrolytic oil 35g, 37wt% formaldehyde 47g, 40wt% catalyst 7.8g, temperature of the first stage and second stage 60℃ and 90℃. Product performances meet the qualification of phenol-formaldehyde resin for the laminates in GB/T14732-2006. The products were characterized by FTIR and HPLC to study mechanism of its reaction. The synthetic adhesive has a good prospect with low cost when using pyrolytic oil instead of pure phenol.