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印刷线路板在复合环境下的腐蚀
引用本文:宁文涛,冯皓,赵钺.印刷线路板在复合环境下的腐蚀[J].环境技术,2010,31(6).
作者姓名:宁文涛  冯皓  赵钺
作者单位:工业产品环境适应性国家重点实验室,中国电器科学研究院
摘    要:印刷线路板几乎会出现在每一种电子设备当中,它是以绝缘材料辅以导体配线所形成的结构元件。印刷线路板的腐蚀形式符合大气腐蚀的基本规律,但又有自己的特点。本文概述了印刷线路板在气体污染物、灰尘、潮湿、高温等多因素复合环境条件下的失效形式及腐蚀机理,其主要的腐蚀形式是:电偶腐蚀、电解腐蚀和缝隙腐蚀;文中还简单总结了印刷线路板腐蚀的主要影响因素,其主要的影响因素是:湿度、温度、腐蚀性气体和固态污染物等。

关 键 词:印刷线路板  腐蚀  机理  影响因素

Corrosion of Printed Circuit Board in Compound Environment
NING Wen-tao,FENG Hao,ZHAO Yue.Corrosion of Printed Circuit Board in Compound Environment[J].Environmental Technology,2010,31(6).
Authors:NING Wen-tao  FENG Hao  ZHAO Yue
Abstract:PCB is a structural element which is formed by insulation material and combined with conductor wiring.It is almost extensively used in all electronic equipment.The corrosion pattern of PCB consists with the basic rule of atmospheric corrosion.However,it has its own characteristics also.This paper summarizes the failure mode and the corrosion mechanism of PCB in the compound environment of many factors such as gas pollutant,dust,moist,high temperature etc.The main corrosion patterns of PCB include galvanic c...
Keywords:PCB corrosion  mechanism  influence factor
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