Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.     

Printed wiring boards for mobile phones: characterization and recycling of copper

The popularization of mobile phones, combined with a technological evolution, means a large number of scrap and obsolete equipment are discarded every year, thereby causing economic losses and environmental pollution. In the present study, the printed wiring boards scrap of mobile phones were characterized in order to recycle some of the device components, using techniques of mechanical processing, hydrometallurgy and electrometallurgy. The use of the techniques of mechanical processing (milling, particle size classification, magnetic and electrostatic separation) was an efficient alternative to obtain a concentrated fraction (mainly iron in the magnetic fraction and copper in the conductive fraction) and another fraction containing polymers and ceramics. At the end of mechanical processing, a concentrated fraction of metals could be obtained with an average concentration of 60% copper. This concentrated fraction in metals was dissolved in aqua regia and sent to electrowinning to recover 92% of the dissolved copper. The obtained cathodes have a copper content above 95%, which demonstrates the technical feasibility of recovery of copper using the techniques of mechanical processing, hydrometallurgy and electrometallurgy.     

Evaluation of gold and silver leaching from printed circuit board of cellphones

Electronic waste has been increasing proportionally with the technology. So, nowadays, it is necessary to consider the useful life, recycling, and final disposal of these equipment. Metals, such as Au, Ag, Cu, Sn and Ni can be found in the printed circuit boards (PCB). According to this, the aims of this work is to characterize the PCBs of mobile phones with aqua regia; obtaining “reference” values of leaching, to gold and silver, with cyanide and nitric acid, respectively; and study the process of leaching of these metals in alternative leaching with sodium thiosulfate and ammonium thiosulfate. The metals were characterized by digesting the sample with aqua regia for 1 and 2 h at 60 °C and 80 °C. The leaching of Au with a commercial reagent (cyanide) and the Ag with HNO₃were made. The leaching of Au and Ag with alternative reagents: Na₂S₂O_3, and (NH₄)₂S₂O₃ in 0.1 M concentration with the addition of CuSO₄, NH₄OH, and H₂O₂, was also studied. The results show that the digestion with aqua regia was efficient to characterize the metals present in the PCBs of mobile phones. However, the best method to solubilize silver was by digesting the sample with nitric acid. The leaching process using sodium thiosulfate was more efficient when an additional concentration of 0.015 and 0.030 M of the CuSO₄ was added.     

Recycling of organic materials and solder from waste printed circuit boards by vacuum pyrolysis-centrifugation coupling technology

Here, we focused on the recycling of waste printed circuit boards (WPCBs) using vacuum pyrolysis-centrifugation coupling technology (VPCT) aiming to obtain valuable feedstock and resolve environmental pollution. The two types of WPCBs were pyrolysed at 600°C for 30 min under vacuum condition. During the pyrolysis process, the solder of WPCBs was separated and recovered when the temperature range was 400-600°C, and the rotating drum was rotated at 1000 rpm for 10 min. The type-A of WPCBs pyrolysed to form an average of 67.91 wt.% residue, 27.84 wt.% oil, and 4.25 wt.% gas; and pyrolysis of the type-B of WPCBs led to an average mass balance of 72.22 wt.% residue, 21.57 wt.% oil, and 6.21 wt.% gas. The GC-MS and FT-IR analyses showed that the two pyrolysis oils consisted mainly of phenols and substituted phenols. The pyrolysis oil can be used for fuel or chemical feedstock for further processing. The recovered solder can be recycled directly and it can also be a good resource of lead and tin for refining. The pyrolysis residues contained various metals, glass fibers and other inorganic materials, which could be recovered after further treatment. The pyrolysis gases consisted mainly of CO, CO(2), CH(4), and H(2), which could be collected and recycled.     

Techniques to separate metal from waste printed circuit boards from discarded personal computers

Waste printed circuit boards contain valuable metals such as Au, Pd, Ag, and Cu that can be reutilized and harmful elements such as Pb, Br, and Cr that must be removed from the viewpoint of environmental conservation. In this research, we examined a method that separates the materials from printed circuit boards contained in discarded personal computers. After cutting the printed circuit boards to a size of 20 × 20 mm, they were heated at 873 K under an Ar atmosphere to remove organic resins containing elements such as C, H, and N. After heat treatment, the printed circuit boards were crushed using a planetary ball mill and the pulverized powders were filtered. The fraction with a granularity of greater than 250 μm was separated into magnetic and nonmagnetic materials by a magnetic field. Because the fraction with a granularity of less than 250 μm contained 39 mass% of C, it was heated at 1273 K in an atmosphere of 95% Ar and 5% O₂ to allow carbon combustion to take place, followed by metal reduction processing at the same temperature in an atmosphere of 97% Ar and 3% H₂. The basicity of the resulting powder was adjusted and the powder was heated at 1773 K under an Ar atmosphere. The proposed method separated the slag and metal, and 80% of the valuable metals contained in printed circuit boards could be collected.     

Pulverization of waste printed circuit boards

A new pulverization method to reduce the volume of waste printed circuit boards is reported. About 50% of printed circuit boards with integrate circuits (ICs) could be pulverized by our method in one 20-min batch, but boards without ICs could not be pulverized. By repeating the process three times, about 95% of printed circuit boards with ICs could be made into a fine powder with particles less than 106µm. A weight-drop test was also performed to examine the strength of the printed circuit boards and clarify the mechanism of pulverization. When a weight was dropped on the solder-welding side of the board ruptures occurred more easily than when the weight was dropped on the IC-mounted side. With a heavy weight, the IC was fractured more easily when the potential energy was low. Where the stress was concentrated, two types of rupture location were found on printed circuit boards with ICs. One was where the IC was connected to the printed circuit board. The other was where the surface had undulations. It also became clear that the fracture of printed circuit boards depends on the impacting weight rather than on the potential energy.     

Depollution benchmarks for capacitors,batteries and printed wiring boards from waste electrical and electronic equipment (WEEE)

The article compiles and analyses sample data for toxic components removed from waste electronic and electrical equipment (WEEE) from more than 30 recycling companies in Switzerland over the past ten years. According to European and Swiss legislation, toxic components like batteries, capacitors and printed wiring boards have to be removed from WEEE. The control bodies of the Swiss take back schemes have been monitoring the activities of WEEE recyclers in Switzerland for about 15 years. All recyclers have to provide annual mass balance data for every year of operation. From this data, percentage shares of removed batteries and capacitors are calculated in relation to the amount of each respective WEEE category treated. A rationale is developed, why such an indicator should not be calculated for printed wiring boards. The distributions of these de-pollution indicators are analysed and their suitability for defining lower threshold values and benchmarks for the depollution of WEEE is discussed. Recommendations for benchmarks and threshold values for the removal of capacitors and batteries are given.     

废印刷线路板资源化研究进展

从废印刷线路板(WPCBs)层间热固性树脂的角度出发,将WPCBs资源化处理技术归纳为热固性树脂直接回收法、热固性树脂分解法和热固性树脂溶胀法,并对现有资源化技术进行总结,同时对将来研究方向进行了展望,为WPCBs资源化产业化发展提供参考。     

Thiourea leaching gold and silver from the printed circuit boards of waste mobile phones

The present communication deals with the leaching of gold and silver from the printed circuit boards (PCBs) of waste mobile phones using an effective and less hazardous system, i.e., a thiourea leaching process as an alternative to the conventional and toxic cyanide leaching of gold. The influence of particle size, thiourea and Fe(3+) concentrations and temperature on the leaching of gold and silver from waste mobile phones was investigated. Gold extraction was found to be enhanced in a PCBs particle size of 100 mesh with the solutions containing 24 g/L thiourea and Fe(3+) concentration of 0.6% under the room temperature. In this case, about 90% of gold and 50% of silver were leached by the reaction of 2h. The obtained data will be useful for the development of processes for the recycling of gold and silver from the PCBs of waste mobile phones.     

Combustion and inorganic bromine emission of waste printed circuit boards in a high temperature furnace

High temperature combustion experiments of waste printed circuit boards (PCBs) were conducted using a lab-scale system featuring a continuously-fed drop tube furnace. Combustion efficiency and the occurrence of inorganic bromine (HBr and Br₂) were systematically studied by monitoring the main combustion products continuously. The influence of furnace temperature (T) was studied from 800 to 1400 °C, the excess air factor (EAF) was varied from 1.2 to 1.9 and the residence time in the high temperature zone (RT_HT) was set at 0.25, 0.5, or 0.75 s.Combustion efficiency depends on temperature, EAF and RT_HT; temperature has the most significant effect. Conversion of organic bromine from flame retardants into HBr and Br₂ depends on temperature and EAF. Temperature has crucial influence over the ratio of HBr to Br₂, whereas oxygen partial pressure plays a minor role. The two forms of inorganic bromine seem substantially to reach thermodynamic equilibrium within 0.25 s. High temperature is required to improve the combustion performance: at 1200 °C or higher, an EAF of 1.3 or more, and a RT_HT exceeding 0.75 s, combustion is quite complete, the CO concentration in flue gas and remained carbon in ash are sufficiently low, and organobrominated compounds are successfully decomposed (more than 99.9%).According to these results, incineration of waste PCBs without preliminary separation and without additives would perform very well under certain conditions; the potential precursors for brominated dioxins formation could be destroyed efficiently. Increasing temperature could decrease the volume percentage ratio of Br₂/HBr in flue gas greatly.     

Evaluation of a recycling process for printed circuit board by physical separation and heat treatment

Printed circuit boards (PCBs) from discarded personal computer (PC) and hard disk drive were crushed by explosion in water or mechanical comminution in order to disintegrate the attached parts. More parts were stripped from PCB of PC, composed of epoxy resin; than from PCB of household appliance, composed of phenol resin.In an attempt to raise the copper grade of PCB by removing other components, a carbonization treatment was investigated. The crushed PCB without surface-mounted parts was carbonized under a nitrogen atmosphere at 873–1073 K. After screening, the char was classified by size into oversized pieces, undersized pieces and powder. The copper foil and glass fiber pieces were liberated and collected in undersized fraction. The copper foil was liberated easily from glass fiber by stamping treatment.As one of the mounted parts, the multi-layered ceramic capacitors (MLCCs), which contain nickel, were carbonized at 873 K. The magnetic separation is carried out at a lower magnetic field strength of 0.1 T and then at 0.8 T. In the +0.5 mm size fraction the nickel grade in magnetic product was increased from 0.16% to 6.7% and the nickel recovery is 74%.The other useful mounted parts are tantalum capacitors. The tantalum capacitors were collected from mounted parts. The tantalum-sintered bodies were separated from molded resins by heat treatment at 723–773 K in air atmosphere and screening of 0.5 mm. Silica was removed and 70% of tantalum grade was obtained after more than 823 K heating and separation.Next, the evaluation of Cu recycling in PCB is estimated. Energy consumption of new process increased and the treatment cost becomes 3 times higher comparing the conventional process, while the environmental burden of new process decreased comparing conventional process.The nickel recovery process in fine ground particles increased energy and energy cost comparing those of the conventional process. However, the environmental burden decreased than the conventional one.The process for recovering tantalum used more heat for the treatment and therefore the energy consumption increased by 50%, when comparing with conventional process. However, the market price for tantalum is very large; the profit for tantalum recovery is added. Also the environmental burden decreased by the recycling of tantalum recovery. Therefore, the tantalum recovery is very important step in the PCB recycling. If there is no tantalum, the consumed energy and treatment cost increase in the new process, though the environmental burden decreases.     

Generation of copper rich metallic phases from waste printed circuit boards

The rapid consumption and obsolescence of electronics have resulted in e-waste being one of the fastest growing waste streams worldwide. Printed circuit boards (PCBs) are among the most complex e-waste, containing significant quantities of hazardous and toxic materials leading to high levels of pollution if landfilled or processed inappropriately. However, PCBs are also an important resource of metals including copper, tin, lead and precious metals; their recycling is appealing especially as the concentration of these metals in PCBs is considerably higher than in their ores. This article is focused on a novel approach to recover copper rich phases from waste PCBs. Crushed PCBs were heat treated at 1150 °C under argon gas flowing at 1 L/min into a horizontal tube furnace. Samples were placed into an alumina crucible and positioned in the cold zone of the furnace for 5 min to avoid thermal shock, and then pushed into the hot zone, with specimens exposed to high temperatures for 10 and 20 min. After treatment, residues were pulled back to the cold zone and kept there for 5 min to avoid thermal cracking and re-oxidation. This process resulted in the generation of a metallic phase in the form of droplets and a carbonaceous residue. The metallic phase was formed of copper-rich red droplets and tin-rich white droplets along with the presence of several precious metals. The carbonaceous residue was found to consist of slag and ～30% carbon. The process conditions led to the segregation of hazardous lead and tin clusters in the metallic phase. The heat treatment temperature was chosen to be above the melting point of copper; molten copper helped to concentrate metallic constituents and their separation from the carbonaceous residue and the slag. Inert atmosphere prevented the re-oxidation of metals and the loss of carbon in the gaseous fraction. Recycling e-waste is expected to lead to enhanced metal recovery, conserving natural resources and providing an environmentally sustainable solution to the management of waste products.     

废弃印刷线路板中材料的资源化回收利用技术

废弃印刷线路板（WPCBs）既有污染环境的一面,又有可资源化回收利用的一面.通过机械物理法、热解、超临界流体氧化和离子液体溶解等方法对其进行分离和回收金属和非金属材料.初步分选的金属需要进一步提纯以实现高附加值.而非金属材料可以用热解法、微波处理、超临界流体技术、等离子技术等技术进行产气和能量回收,也可以通过制备建筑材料或填料和其它功能村料进行物料回收.总之,对WPCBs进行适当地处理不但可以减轻环境压力,还可以变废为宝,实现资源再生利用.     

Process development for recovery of copper and precious metals from waste printed circuit boards with emphasize on palladium and gold leaching and precipitation

A novel hydrometallurgical process was proposed for selective recovery of Cu, Ag, Au and Pd from waste printed circuit boards (PCBs). More than 99% of copper content was dissolved by using two consecutive sulfuric acid leaching steps in the presence of H₂O₂ as oxidizing agents. The solid residue of 2nd leaching step was treated by acidic thiourea in the presence of ferric iron as oxidizing agent and 85.76% Au and 71.36% Ag dissolution was achieved. The precipitation of Au and Ag from acidic thiourea leachate was investigated by using different amounts of sodium borohydride (SBH) as a reducing agent. The leaching of Pd and remained gold from the solid reside of 3rd leaching step was performed in NaClO-HCl-H₂O₂ leaching system and the effect of different parameters was investigated. The leaching of Pd and specially Au increased by increasing the NaClO concentration up to 10 V% and any further increasing the NaClO concentration has a negligible effect. The leaching of Pd and Au increased by increasing the HCl concentration from 2.5 to 5 M. The leaching of Pd and Au were endothermic and raising the temperature had a positive effect on leaching efficiency. The kinetics of Pd leaching was quite fast and after 30 min complete leaching of Pd was achieved, while the leaching of Au need a longer contact time. The best conditions for leaching of Pd and Au in NaClO-HCl-H₂O₂ leaching system were determined to be 5 M HCl, 1 V% H₂O₂, 10 V% NaClO at 336 K for 3 h with a solid/liquid ratio of 1/10. 100% of Pd and Au of what was in the chloride leachate were precipitated by using 2 g/L SBH. Finally, a process flow sheet for the recovery of Cu, Ag, Au and Pd from PCB was proposed.     

Recycling of printed circuit boards: ultrasound-assisted comminution and leaching for metals recovery

Journal of Material Cycles and Waste Management - The increase of electronic equipment consumption associated makes the recycling process crucial worldwide. Use of emerging technologies for...     

Qualitative and quantitative determination of heavy metals in waste cellular phones

Twenty four waste cellular phones, manufactured between 2002 and 2011, were selected in order to determine the total heavy metal content in each of their parts (printed circuit boards (PCBs), plastic housing (PH) and liquid crystal display monitors (LCDs)) and compare the results with the permissible limits set by the 2003 Directive on Restriction of Hazardous Substances (RoHS). All the selected samples were pulverized and digested with strong acids. Inductively coupled plasma-mass spectrometry was used to measure the heavy metal content in each sample. The results revealed that concentration levels of the examined heavy metals were higher in PCBs, followed by PH and LCD in that particular order (PCB > PH > LCD). With the exception of Pb and Cr present in PCBs of mobile phones released before the year 2006, all the other metal concentrations were according to the Directive. Concentration levels of Cd, Hg were lower than the permissible limits set by the EU, either before or after the validity of the 2003 RoHS Directive. Considering their significant heavy metal content, coupled with their large quantities produced worldwide in an annual rate, waste cellular phones need to be treated under an environmentally sound management scheme, prioritizing recycling and at the same time eliminating the possibility of any harm.     

Pyrolysis characteristics of the mixture of printed circuit board scraps and coal powder

Thermogravimetric (TG) analysis and infrared spectroscopy were used to analyze the pyrolysis characteristics of printed circuit board scraps (PCBs), coal powder and their mixtures under nitrogen atmosphere. The experimental results show that there is a large difference between waste PCBs and coal powder in pyrolysis processing. The pyrolysis properties of the mixing samples are the result of interaction of the PCBs and coal powder, which is influenced by the content of mixture. The degree of pyrolysis and pyrolysis properties of the mixture are much better than that of the single component. The TG and the differential thermogravimetric (DTG) curves of the PCBs mixed with coal powder move towards the high-temperature zone with increasing amount of coal powder and subsequently the DTG peak also becomes wider. The Coats–Redfern integral method was used to determine the kinetic parameters of pyrolysis reaction mechanism with the different proportion of mixture. The gas of pyrolysis mainly composes of CO₂, CO, H₂O and some hydrocarbon. The bromide characteristic absorption peak has been detected obviously in the pyrolysis gas of PCBs. On the contrary, the absorption peak of the bromide is not obvious in pyrolysis gas of the PCBs samples adding 40% coal powder.     

Assessment of toxic metals in waste personal computers

Considering the enormous production of waste personal computers nowadays, it is obvious that the study of their composition is necessary in order to regulate their management and prevent any environmental contamination caused by their inappropriate disposal. This study aimed at determining the toxic metals content of motherboards (printed circuit boards), monitor glass and monitor plastic housing of two Cathode Ray Tube (CRT) monitors, three Liquid Crystal Display (LCD) monitors, one LCD touch screen monitor and six motherboards, all of which were discarded. In addition, concentrations of chromium (Cr), cadmium (Cd), lead (Pb) and mercury (Hg) were compared with the respective limits set by the RoHS 2002/95/EC Directive, that was recently renewed by the 2012/19/EU recast, in order to verify manufacturers’ compliance with the regulation. The research included disassembly, pulverization, digestion and chemical analyses of all the aforementioned devices. The toxic metals content of all samples was determined using Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). The results demonstrated that concentrations of Pb in motherboards and funnel glass of devices with release dates before 2006, that is when the RoHS Directive came into force, exceeded the permissible limit. In general, except from Pb, higher metal concentrations were detected in motherboards in comparison with plastic housing and glass samples. Finally, the results of this work were encouraging, since concentrations of metals referred in the RoHS Directive were found in lower levels than the legislative limits.     

Recycling of non-metallic fractions from waste electrical and electronic equipment (WEEE): A review

The world’s waste electrical and electronic equipment (WEEE) consumption has increased incredibly in recent decades, which have drawn much attention from the public. However, the major economic driving force for recycling of WEEE is the value of the metallic fractions (MFs). The non-metallic fractions (NMFs), which take up a large proportion of E-wastes, were treated by incineration or landfill in the past. NMFs from WEEE contain heavy metals, brominated flame retardant (BFRs) and other toxic and hazardous substances. Combustion as well as landfill may cause serious environmental problems. Therefore, research on resource reutilization and safe disposal of the NMFs from WEEE has a great significance from the viewpoint of environmental protection. Among the enormous variety of NMFs from WEEE, some of them are quite easy to recycle while others are difficult, such as plastics, glass and NMFs from waste printed circuit boards (WPCBs). In this paper, we mainly focus on the intractable NMFs from WEEE. Methods and technologies of recycling the two types of NMFs from WEEE, plastics, glass are reviewed in this paper. For WEEE plastics, the pyrolysis technology has the lowest energy consumption and the pyrolysis oil could be obtained, but the containing of BFRs makes the pyrolysis recycling process problematic. Supercritical fluids (SCF) and gasification technology have a potentially smaller environmental impact than pyrolysis process, but the energy consumption is higher. With regard to WEEE glass, lead removing is requisite before the reutilization of the cathode ray tube (CRT) funnel glass, and the recycling of liquid crystal display (LCD) glass is economically viable for the containing of precious metals (indium and tin). However, the environmental assessment of the recycling process is essential and important before the industrialized production stage. For example, noise and dust should be evaluated during the glass cutting process. This study could contribute significantly to understanding the recycling methods of NMFs from WEEE and serve as guidance for the future technology research and development.     

离子液体对废旧印刷线路板中铜、锌、铅的浸出规律

以离子液体1-丁基磺酸-3-甲基咪唑三氟甲烷磺酸盐([BSO_3HMIm]OTf)为浸出剂,初步研究了WPCBs浸铜过程中锌和铅浸出率的影响因素。实验结果表明:铜、锌的浸出率随着WPCBs粒径的减小、H_2O_2溶液加入量的增大而增大,铜的浸出率随浸出温度的升高先增大后减小,锌的浸出率受浸出温度影响不大;铅的浸出率受5种因素影响不大,且总体处于较低水平。在WPCBs粒径为0.100~0.250 mm、离子液体加入量为60.0%(φ)、H_2O_2溶液加入量为7.5%(φ)、固液比为1∶15、浸出温度为50℃的条件下,铜、锌、铅的浸出率分别为99.84%,93.25%,22.46%。