废弃印刷线路板中环氧树脂的资源化技术

印刷线路板是电子工业的基础,伴随着电子废弃物的快速增长,废弃印刷线路板的回收已经成为迫切需要研究的领域。对废弃印刷线路板中环氧树脂常用的资源化方法、物理法、热解法、超临界法及化学溶剂法等进行了介绍,并比较了几种方法的优缺点。     

我国废弃电子线路板资源化再生利用技术现状与展望

随着电子行业的迅猛发展,废弃电子线路板的处理和利用成为各方关注的热点。废弃电子线路板处理不好将成为一大环境污染问题,而利用好了又可变废为宝,产生巨大的价值。阐述我国进行废弃电子线路板资源化再生利用的重要性和紧迫性,介绍废弃电子线路板处理利用技术的研究现状,并时其研究重点和发展趋势做出展望。     

废弃印刷线路板中材料的资源化回收利用技术

废弃印刷线路板（WPCBs）既有污染环境的一面,又有可资源化回收利用的一面.通过机械物理法、热解、超临界流体氧化和离子液体溶解等方法对其进行分离和回收金属和非金属材料.初步分选的金属需要进一步提纯以实现高附加值.而非金属材料可以用热解法、微波处理、超临界流体技术、等离子技术等技术进行产气和能量回收,也可以通过制备建筑材料或填料和其它功能村料进行物料回收.总之,对WPCBs进行适当地处理不但可以减轻环境压力,还可以变废为宝,实现资源再生利用.     

废旧线路板非金属材料综合利用

随着信息时代的到来,废印刷线路板处理技术日益成熟,大量的废线路板非金属粉亟需处理。从环境保护和资源回收的角度,综述了废印刷线路板非金属粉的资源化利用。     

专利资讯

专利名称：一种利用高压热风自动分离废弃线路板元件的方法 本发明涉及一种利用高压热风自动分离废弃线路板元件的方法,该方法包括将待分离的废弃线路板采用钉式结构固装在传送带上进行传送,采用高压高温气流冲击的分离方式分离所述废弃线路板的基板和元器件;分离时将高压高温气流以风刀或类似风刀开缝口的形式吹出,以去除焊料并迫使元器件脱落。本发明实现了自动分离废弃线路板元件的工业应用,并无害化处理有毒有害气体,高效处理线路板并无损地回收大量价值元件,为再资源化提供了可能。     

直接电解回收覆铜板废料上的铜

覆铜板边角料是废弃线路板的一种,通过设计合理的电解工艺制度,对覆铜板废料上金属锡和铜进行退除.该方法无需破碎,可直接电解覆铜板废料,同时退除板上的金属锡和铜,并直接回收得到阴极电解铜产品.该方法与处理废弃线路板常用的机械物理法和化学酸浸法相比,具有成本低、能耗低、操作简单等优势.     

废印刷线路板资源化研究进展

从废印刷线路板(WPCBs)层间热固性树脂的角度出发,将WPCBs资源化处理技术归纳为热固性树脂直接回收法、热固性树脂分解法和热固性树脂溶胀法,并对现有资源化技术进行总结,同时对将来研究方向进行了展望,为WPCBs资源化产业化发展提供参考。     

一种废弃印刷线路板取制样方法的应用

随着我国家电和电子产品进入淘汰报废高峰期,废弃印刷线路板的数量也随之急剧增加,线路板中含有大量的金属,具有很高的回收价值,而市场上对废弃印刷线路板的回收缺乏健全的制度和标准、规范的方法。对废弃线路板取制样方法展开试验研究,借鉴国外关于电子废料的抽样检验经验,按照抽样、初破、分拣、取样、粉碎、分选等流程操作后,实现样品中金属和非金属物料的有效分离。金属物料和非金属物料分别制备成试样后经化验分析出品位数据,根据比例和数量加权计算出废弃线路板的综合品位,从而形成一套科学的、标准的线路板取制样方法,为废线路板回收交易提供精确的数据支持。     

专利资讯

一种从电子废弃物中提取金属铜的方法;回收废弃印刷电路板的方法;一种从废弃印刷线路板表面提取贵金属的方法及专用夹具;带显像管的电视、电脑的拆解设备;多功能胶囊粉碎回收机     

专利资讯

专利名称：废旧印刷电路板中非金属材料的再利用方法,专利名称：电路板及电镀污泥资源化回收工艺,专利名称：利用废弃印刷电路板中非金属材料制备酚醛模塑料的方法,专利名称：一种汽车与电子废弃电路板的脱焊设备,专利名称：从镀金印刷电路板废料中回收金和铜的方法.     

废旧电路板上残留焊锡剥离液的研制

以硝酸-磺酸型退锡剂为基础配方,研制了一种脱除废旧电路板表面残留焊锡的剥离液.该剥离液以硝酸为氧化剂,氨基磺酸为稳定剂,苯并三氮唑为铜的缓蚀剂.实验结果表明:剥离液的最佳配比为硝酸浓度3 mol/L,氨基磺酸浓度0.4 mol/L,苯并三氮唑浓度0.08 mol/L;每升剥离液可处理3.5 kg废旧电路板,处理后电路板中的铅离子含量降至100 mg/kg以下.该剥离液处理后的电路板表面的铜箔保持完好,基本没有被剥离液浸蚀.     

Enrichment of the metallic components from waste printed circuit boards by a mechanical separation process using a stamp mill

Printed circuit boards incorporated in most electrical and electronic equipment contain valuable metals such as Cu, Ni, Au, Ag, Pd, Fe, Sn, and Pb. In order to employ a hydrometallurgical route for the recycling of valuable metals from printed circuit boards, a mechanical pre-treatment step is needed. In this study, the metallic components from waste printed circuit boards have been enriched using a mechanical separation process. Waste printed circuit boards shredded to <10mm were milled using a stamp mill to liberate the various metallic components, and then the milled printed circuit boards were classified into fractions of <0.6, 0.6-1.2, 1.2-2.5, 2.5-5.0, and >5.0mm. The fractions of milled printed circuit boards of size <5.0mm were separated into a light fraction of mostly non-metallic components and a heavy fraction of the metallic components by gravity separation using a zig-zag classifier. The >5.0mm fraction and the heavy fraction were subjected to two-step magnetic separation. Through the first magnetic separation at 700 Gauss, 83% of the nickel and iron, based on the whole printed circuit boards, was recovered in the magnetic fraction, and 92% of the copper was recovered in the non-magnetic fraction. The cumulative recovery of nickel-iron concentrate was increased by a second magnetic separation at 3000 Gauss, but the grade of the concentrate decreased remarkably from 76% to 56%. The cumulative recovery of copper concentrate decreased, but the grade increased slightly from 71.6% to 75.4%. This study has demonstrated the feasibility of the mechanical separation process consisting of milling/size classification/gravity separation/two-step magnetic separation for enriching metallic components such as Cu, Ni, Al, and Fe from waste printed circuit boards.     

Pulverization of waste printed circuit boards

A new pulverization method to reduce the volume of waste printed circuit boards is reported. About 50% of printed circuit boards with integrate circuits (ICs) could be pulverized by our method in one 20-min batch, but boards without ICs could not be pulverized. By repeating the process three times, about 95% of printed circuit boards with ICs could be made into a fine powder with particles less than 106µm. A weight-drop test was also performed to examine the strength of the printed circuit boards and clarify the mechanism of pulverization. When a weight was dropped on the solder-welding side of the board ruptures occurred more easily than when the weight was dropped on the IC-mounted side. With a heavy weight, the IC was fractured more easily when the potential energy was low. Where the stress was concentrated, two types of rupture location were found on printed circuit boards with ICs. One was where the IC was connected to the printed circuit board. The other was where the surface had undulations. It also became clear that the fracture of printed circuit boards depends on the impacting weight rather than on the potential energy.     

热解技术处理废弃电路板的研究进展

介绍了回收废弃电路板的热分离方法,综述了热解技术在废弃电路板处理中的研究现状及其所具有的优势。阐述了废弃电路板热解产物的资源价值及热解油的分离与提纯的研究现状,讨论了热解技术处理废弃电路板过程中消除剧毒有机溴化合物及HBr回收的研究进展,同时简介了真空热解技术的研究概况,并指出真空热解技术是今后处理废弃电路板的研究方向之一,有广阔的应用前景。     

Recycling of WEEE: characterization of spent printed circuit boards from mobile phones and computers

This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results of this paper show that copper concentration is increasing in mobile phones and remaining constant in personal computers.     

用废旧电路板热解油制备酚醛树脂

在碳酸钙存在下,采用热解技术将废旧电路板中的树脂转化为富含酚的热解油,然后直接加入甲醛溶液反应制备热解油型酚醛树脂,实现了废旧电路板中树脂的再生,酚醛树脂的性能结构类似于氨催化的酚醛树脂。实验结果表明：在n（甲醛）：n（热解油）为1．8～2．1的条件下,无需外加催化剂,在60,80,90℃下分别反应30min制备的热解油型酚醛树脂的性能最佳,且可满足GB／T14732—93《木材工业胶黏剂用脲醛、酚醛、三氧氰胺甲醛树脂》中层压材料用酚醛树脂产品的相关标准。     

Copper recovery from leach solution of waste printed circuit boards by pulse current electrodeposition

Journal of Material Cycles and Waste Management - The copper recovery from waste printed circuit boards is of great significance to protect natural resource and environment. Direct current...     

Recovery of valuable metals from WPCB fines by centrifugal gravity separation and froth flotation

Journal of Material Cycles and Waste Management - This paper reports physical and physicochemical routes for the recycling of gold, silver, and copper from waste printed circuit boards (WPCBs). The...     

Thermodynamic analysis of metals recycling out of waste printed circuit board through secondary copper smelting

Journal of Material Cycles and Waste Management - In this paper, a detailed thermodynamic analysis of processing of electronic waste (e-waste), particularly printed circuit boards (PCB), through...     

Influence factors of determining optimal organic solvents for swelling cured brominated epoxy resins to delaminate waste printed circuit boards

Journal of Material Cycles and Waste Management - In the previous study, organic solvent dimethyl sulfoxide (DMSO) could effectively delaminate waste printed circuit boards (WPCBs) by swelling...