电路板的高加速应力筛选仿真设计技术研究

针对某型电路板高加速应力筛选剖面设计中耗费大量人力物力的实际情况,结合目前计算机辅助及仿真技术所具有的成本低、周期短、精度高等特点,将高加速应力筛选及计算机仿真技术融合,提出了运用计算机仿真手段来研究产品的高加速应力筛选剖面的方法及基本思路。对剩余有效寿命的预计、缺陷影响以及应力影响等方面进行了研究分析。从而在高加速应力筛选剖面设计信息量的扩充、成本的节省、周期的缩短等方面起到了一定的促进作用。     

用GC/MS分析火灾后苯板产生固体废物中的有机物

采用GC/MS方法对某苯板厂火灾后产生的固体废弃物进行检测分析.结果表明,在苯板火灾后产生的固体废弃物中检测出61种化合物,其中被美国EPA列入优先污染物的苯系物、萘和蒽等占总有机物12.2％.     

微波辐照热解废印刷电路板产物的分析研究

为了减少电子废弃物对环境的危害,实现其资源化回收利用,研究了微波辐照热解废印刷电路板的效果,并采用红外光谱、气相色谱质谱和X荧光光谱等方法对热解产物的组成及性质进行了分析.结果显示:微波热解得到的气体、液体、固体的产率分别为7%～33%、26%～45%、31%～51%,其中气体主要由CO、CO2、H2及有机烃类组成,可燃性气体占70%(体积分数)左右,可作为燃料气加以利用;液体分为水相及油相,经常压蒸馏后得到的120～250 ℃馏分主要为单酚化合物,苯酚高达50%(质量分数)左右,甲基苯酚和邻甲基苯酚为25%(质量分数)以上,是良好的化工原料;固体中除炭外,还含有许多金属如铅、锡和铜等,可以回收利用.说明微波热解技术处理电子废弃物可实现资源化回收利用.     

Printed wiring boards for mobile phones: characterization and recycling of copper

The popularization of mobile phones, combined with a technological evolution, means a large number of scrap and obsolete equipment are discarded every year, thereby causing economic losses and environmental pollution. In the present study, the printed wiring boards scrap of mobile phones were characterized in order to recycle some of the device components, using techniques of mechanical processing, hydrometallurgy and electrometallurgy. The use of the techniques of mechanical processing (milling, particle size classification, magnetic and electrostatic separation) was an efficient alternative to obtain a concentrated fraction (mainly iron in the magnetic fraction and copper in the conductive fraction) and another fraction containing polymers and ceramics. At the end of mechanical processing, a concentrated fraction of metals could be obtained with an average concentration of 60% copper. This concentrated fraction in metals was dissolved in aqua regia and sent to electrowinning to recover 92% of the dissolved copper. The obtained cathodes have a copper content above 95%, which demonstrates the technical feasibility of recovery of copper using the techniques of mechanical processing, hydrometallurgy and electrometallurgy.     

微电解/斜板沉淀/生物接触氧化处理印刷电路板废水

根据某印刷电路板企业生产废水的水质特点,对废水进行分类收集处理后,采用微电解/斜板沉淀/生物接触氧化工艺处理综合废水。工程运行结果表明,该工艺处理效果稳定,出水水质符合《污水综合排放标准》(GB 8978-1996)的一级排放标准。     

铁炭微电解预处理电路板废水

采用铁炭微电解法预处理电路板废水.结果表明,在进水pH为2.00、铁炭质量比为4:1、振荡时间为20 min的铁炭微电解静态实验最佳条件下,絮凝出水COD去除率为30%;在进水pH为2.00、铁炭质量比为4:1、水力停留时间为50 min的铁炭微电解柱动态实验最佳条件下,连续曝气.絮凝出水COD为11021 mg/L,COD去除率约为34%,BOD5/COD从0.12上升到0.32,可生化性提高,Cu2+质量浓度从9.11 mg/L下降至0.76 mg/L,降低了废水的生物毒性,为生化处理创造了条件.     

废弃印刷线路板碘化法浸金研究

针对碘化法从废弃印刷线路板中提取金的工艺设计,分别考察了碘的质量分数、n(I₂)/n(I^-)比值、固液比、双氧水的质量分数、pH值、浸出时间和浸出温度对金浸出率的影响。结合正交设计优化实验方法,提出了从废弃印刷线路板中碘化法浸取金的最佳工艺条件：碘的质量分数为1.1％,n(I₂)∶n(I^-)=1∶10,双氧水的质量分数为1.5％,浸出时间4 h,固液比为1∶10,浸出温度为常温（25℃）,溶液pH值为中性,此时金浸出率可达97.5％。     

液-固流化床回收印刷线路板中金属的研究

根据废弃印刷线路板中材料密度不同,采用水介质流化床对印刷线路板粉末中的金属进行回收,对0.25～0.177、0.177～0.104、0.104～0.074和-0.074 mm 4个粒级范围内的物料进行分选试验。试验结果表明,在上述4个粒级范围内,随介质流速的增大,金属回收率降低;金属回收率η与实际操作速度（ua）和颗粒终端沉降速度（ut）的比值φ（ua/ut）存在一定线性关系,分析模拟了η与φ之间的相关性方程,外推试验的结果证明了相关性方程的可靠性;在合适的操作条件下,各粒级范围内金属的回收率分别为95.02%、90.07%、87.5%和92.68%。     

膜电解法在线再生酸性蚀刻液及回收铜新技术

采用极化曲线法研究了酸性蚀刻液阴、阳极电化学行为,并构建了离子膜电解反应体系,考察了在线再生酸性蚀刻液及回收铜的效果。结果表明,阳极氧化过程发生浓差极化,存在极限电流密度,Cu＋含量越高,极限电流密度越大;阴极还原分4步反应进行,存在极限电流密度;强化溶液传质可有效提高阴、阳极极限电流密度,有利于避免电解过程中析出氯气和氢气;在线实验表明,通过监控阳极液ORP,可避免析出氯气;分步降低电流电解有利于避免析出氢气,形成致密的金属铜块;在电流为9～24A范围内分4步电解23．5h可再生酸性蚀刻液23．5L,同时电沉积回收510g铜,纯度高达99．98％。阴极电流效率达到95．2％,吨铜电耗3251kWh。电解过程中无氯气和氢气析出,无废液排放,表明膜电解法在线再生酸性蚀刻液具有良好的应用前景。     

Influences of Magnesium <Emphasis Type="Italic">tri-</Emphasis>Silicate on the Physical,Mechanical, and Degradable Properties of Ultraviolet (UV) Radiation Cured Plain Board Surface

A series of formulations were prepared with different percentages of oligomer, epoxy diacrylate (EA-1020 ), monomer, 1,6 Hexane diol diacrylate,(HDDA) and different percentages of filler (Magnesium tri-silicate, Mg₂Si₃O₈). Irgacure 369 [2-Benzyl-2-dimethyl-amine-1 (4-morpholinophenyl) butanone-1] was used in the formulations as photoinitiator. Ultraviolet (UV) cured thin polymer films were prepared from these formulating solutions on clean glass plates. Pendulum hardness (PH), gel content and macro scratch hardness (MSH) of the UV cured films were studied. One percent Mg₂Si₃O₈ containing formulation showed the premium properties. The substrates (plain board) were coated by these formulating solutions and cured under the same UV lamp at different intensities of radiation. Various properties of the coated surface such as PH, gloss, adhesion, abrasion and MSH were investigated. The base coat containing 1% Mg₂Si₃O₈ and top coat containing 48% HDDA produced the best performance among all the formulations inspected. The degradable properties in different weathering conditions on PH, gloss, adhesion, abrasion and MSH were measured. The surface cured with the optimized formulation (E) again yielded the minimum loss of the properties.