印刷电路板(PCB)厂挥发性有机物(VOCs)排放指示物筛选

采用VOCs快速测定仪和SUMMA罐采样、GC/MS分析方法,采样分析了上海某工业区3个印刷电路板厂生产车间和废气排放口的VOCs含量水平、组成特征和源成分谱.结果表明,在9月和12月2次采样期间,A、B、H厂生产车间总挥发性有机物(TVOCs)(9月/12月)最高浓度分别为(2.94/2.01)×10-9、(3.18/1.11)×10-6、(0.70/0.18)×10-9;废气排放口TVOCs最高浓度则分别为(0.86/0.90)×10-9、(31.2/12.0)×10-6、(1.24/0.30)×10-9.GC/MS分析结果表明,主要检出了烷烃、烯烃、苯系物、酮类、氯代烷烃、氯代苯类、酯类等7大类共67种VOCs化合物;A、B、H厂生产车间/废气排放口最高检出物和检出浓度分别为:2-丁酮6.73 mg.m-3/2-甲基己烷5.93 mg.m-3、乙酸乙酯8.90 mg.m-3/丙烷9.64 mg.m-3、丙烷2.04 mg.m-3/丙烷1.69 mg.m-3.苯、甲苯、二甲苯检出率均为100%,三厂各点位最高检出浓度/平均浓度分别为0.077 mg.m-3/0.035 mg.m-3、0.56 mg.m-3/0.31 mg.m-3、0.21 mg.m-3/0.12 mg.m-3(间+对-二甲苯)和0.081 mg.m-3/0.050 mg.m-3(邻-二甲苯).源成分谱和PCA分析结果表明,A、B厂的VOCs特征轮廓图谱较相似,特征化合物为苯、甲苯、二甲苯以及丙酮和2-丁酮;H厂主要特征污染物除三苯外,还有氯苯和氯代烷烃类化合物.结合原辅材料及生产工艺分析,溶剂、涂料使用和工艺过程的逸散是生产车间面源VOCs排放的主要来源,废气排放口是VOCs重点排放点源.     

基于投入产出与生命周期评价的集成电路产业环境影响分析

我国集成电路产业正蓬勃发展,在国家经济与高科技产业中占据重要地位。基于投入产出与生命周期评价,分别使用生命周期评价软件SimaPro7.0中的Eco-indicator 98与IMPACT 2002+2种评价模式作为量化影响评价方法,分析了我国集成电路产业的生产制造过程对环境的影响。根据Eco-indicator98分析结果,集成电路产业的各项环境影响中,重金属污染最高,其次为能源消耗、夏季烟雾、温室效应等;而IMPACT 2002+的损害评价结果显示,人体健康危害为集成电路产业最显著的环境损害,其次为生态系统质量、资源消耗及气候变化。在评估能源消耗与气候变化影响时,2种模式的结果一致。     

断路器抗冲击性能考核试验时的安装方向选择

舰艇设备的抗冲击能力是其作战性能的重要指标之一,对于其装舰前的冲击试验考核是环境试验的一项重要内容,在无法明确设备在舰上安装方式和方向时,考核应模拟最严酷的工作条件和船上可能使用的安装方法,以船用典型断路器为例,简要描述了冲击条件下最严酷安装状态的分析选择过程,以期作为其它舰用设备冲击考核试验所选试验工况的参考。     

Qualitative and quantitative determination of heavy metals in waste cellular phones

Twenty four waste cellular phones, manufactured between 2002 and 2011, were selected in order to determine the total heavy metal content in each of their parts (printed circuit boards (PCBs), plastic housing (PH) and liquid crystal display monitors (LCDs)) and compare the results with the permissible limits set by the 2003 Directive on Restriction of Hazardous Substances (RoHS). All the selected samples were pulverized and digested with strong acids. Inductively coupled plasma-mass spectrometry was used to measure the heavy metal content in each sample. The results revealed that concentration levels of the examined heavy metals were higher in PCBs, followed by PH and LCD in that particular order (PCB > PH > LCD). With the exception of Pb and Cr present in PCBs of mobile phones released before the year 2006, all the other metal concentrations were according to the Directive. Concentration levels of Cd, Hg were lower than the permissible limits set by the EU, either before or after the validity of the 2003 RoHS Directive. Considering their significant heavy metal content, coupled with their large quantities produced worldwide in an annual rate, waste cellular phones need to be treated under an environmentally sound management scheme, prioritizing recycling and at the same time eliminating the possibility of any harm.     

Process development for recovery of copper and precious metals from waste printed circuit boards with emphasize on palladium and gold leaching and precipitation

A novel hydrometallurgical process was proposed for selective recovery of Cu, Ag, Au and Pd from waste printed circuit boards (PCBs). More than 99% of copper content was dissolved by using two consecutive sulfuric acid leaching steps in the presence of H₂O₂ as oxidizing agents. The solid residue of 2nd leaching step was treated by acidic thiourea in the presence of ferric iron as oxidizing agent and 85.76% Au and 71.36% Ag dissolution was achieved. The precipitation of Au and Ag from acidic thiourea leachate was investigated by using different amounts of sodium borohydride (SBH) as a reducing agent. The leaching of Pd and remained gold from the solid reside of 3rd leaching step was performed in NaClO-HCl-H₂O₂ leaching system and the effect of different parameters was investigated. The leaching of Pd and specially Au increased by increasing the NaClO concentration up to 10 V% and any further increasing the NaClO concentration has a negligible effect. The leaching of Pd and Au increased by increasing the HCl concentration from 2.5 to 5 M. The leaching of Pd and Au were endothermic and raising the temperature had a positive effect on leaching efficiency. The kinetics of Pd leaching was quite fast and after 30 min complete leaching of Pd was achieved, while the leaching of Au need a longer contact time. The best conditions for leaching of Pd and Au in NaClO-HCl-H₂O₂ leaching system were determined to be 5 M HCl, 1 V% H₂O₂, 10 V% NaClO at 336 K for 3 h with a solid/liquid ratio of 1/10. 100% of Pd and Au of what was in the chloride leachate were precipitated by using 2 g/L SBH. Finally, a process flow sheet for the recovery of Cu, Ag, Au and Pd from PCB was proposed.     

极端温度条件典型引信电参数变化规律和失效机理

目的 研究某电子时间引信在?60~140 ℃下电参数的变化规律和失效机理。方法 利用高低温试验机开展步进应力强化试验,增加和细化引信检测参数,在被试引信工作状态下全程记录电参数的变化,开展失效机理分析。结果 得到了引信基准频率、电能损耗率等电参数的温度特性规律和参数变化范围,发现了?60 ℃低温掉电、130 ℃高温短路等故障模式和机理,并提出改进建议。结论 验证了极端温度应力叠加电应力的强化试验方法,获得了引信电性能参数变化规律,发现了极端温度条件下新的失效模式和失效机理。     

电选法回收利用废印刷线路板

废印刷线路板含有多种有价值的物质，随意丢弃或处理处置方法不当既污染环境，又造成资源流失。采用剪切式破碎和电力分选技术对废印刷线路板的机械分离进行了研究。结果表明，电选法可以实现废印刷线路板中金属和玻璃纤维、树脂的分离；在实验的粒径范围内（-14＋20目到-120＋200目分为5个粒径级别），金属主要集中在-20＋120目粒级范围内，且该粒级范围分选效果最好。     

废电路板非金属材料再生木塑产品环境安全性评价

为了评价废电路板非金属材料再生产品使用过程中的环境安全性问题,本文针对非金属材料再生产品的特性,参考相关评价标准,结合目前现有的环境危害评价方法和人体健康风险评价,构建了再生产品在使用过程中环境安全性评价模型.收集A、B两种再生木塑产品进行评价试验,评估其对环境和人体健康的潜在风险和危害.结果显示在不考虑水体稀释作用情况下,两种再生木塑产品对I类地表水均存在极度或重度污染的可能,对于其他类地表水环境风险较小,应避免在源头水等区域使用;对于地下水,产品B污染指数大于1,具有一定的环境风险;但是考虑在稀释情况下（5%）,两种再生产品对于地下水的污染指数均小于1;两种再生木塑产品的非致癌风险指数分别为0.03和0.41,均小于1,对人体健康的危害作用不明显.本文可为非金属材料再生木塑产品环境安全性管理提供评价标准和参考,有利于促进废弃电器电子产品资源化和无害化技术的发展．     

资源型城市工矿用地系统修复的生态安全格局构建

资源型城市可持续发展的关键是对其工矿用地进行系统修复,在空间上统筹工矿用地的生态修复,使其从整体上参与区域生态安全格局构建十分必要。基于生态安全格局与电路理论,以典型资源型城市内蒙古自治区乌海市为例,分别识别2000年、2005年、2011年、2017年生态廊道和关键点,根据优先修复程度设置修复分级方案。研究结果表明：（1）2000-2017年,廊道路径上工矿用地面积增加和城市扩张导致生态廊道质量下降、位置发生变化。7条最小耗费路径总长度从120.74 km增加到125.71 km;加权耗费总距离从692.58 km增加到1162.28 km。（2）识别出2017年障碍点14处,总面积为16.06 km²。其中关键点12处,总面积14.09 km²。 （3）修复区域为识别出的2000-2017年四期生态廊道和2017年关键点,共划分三个修复等级,总面积为475.86 km²。研究通过区域生态安全格局理念统筹工矿用地生态修复,使之成为国土空间系统修复的有机整体,为资源型城市可持续发展提供决策参考。     

药型端面包覆层自动修复系统方案设计

目的改善药型端面包覆层现行人工修复生产率低、安全性差等缺陷。方法设计防爆药型端面包覆层自动化修复系统,并对药型端面包覆层自动修复系统的机械结构组成、气动回路和PLC控制系统进行详细说明。结果与传统的修复方式相比,药型端面包覆层自动修复系统可实现对药型包覆层的自动化修复,改善生产人员的工作环境,减轻生产人员的劳动强度,提高生产效率。同时针对生产过程中的实际需求,设计了自动、半自动与调整等三种工作模式,以便于使用中对设备的调整和日常维护保养。结论该方案提高了药型端面包覆层修复效率,减少了一线生产人员的数量,降低了劳动强度,保障了生产的安全性。