Metal microchannel lamination using surface mount adhesives for low-temperature heat exchangers

This paper reports the feasibility of using surface mount adhesives to produce low temperature microchannel arrays in a wide variety of metals. Sheet metal embossing and chemical etching processes have been used to produce sealing bosses that eliminate channel laminae, resulting in approximately 50% material savings over traditional methods. An assembly process using adhesive dispense and cure is outlined to produce leak-free devices. Optimal fill ratios were determined to be between 1.1 and 1.25. Bond strength investigation reveals robustness to surface conditions and a bond strength of 5.5–8.5 MPa using a 3X safety factor. Dimensional characterization reveals a two sigma (95%) post-bonded channel height tolerance under 10% after bonding. Patterning tolerance and surface roughness of the laminae faying surfaces were found to have a significant influence on the final post-bonded channel height. Leakage and burst pressure testing on several samples has established confidence that adhesive bonding can produce leak-free joints. Operating pressures up to 413 kPa have been satisfied, equating to tensile pressure on bond joints of 1.9 MPa. Higher operating pressures can be accommodated by increasing the bond area of devices.     

Metal accumulation and health risk assessment in wastewater used for irrigation around the Agra Canal in Faridabad,India

Environmental Science and Pollution Research - Wastewater application for irrigation is a traditional and economic tool in developing nations. Yet prolonged use of wastewater for agricultural...     

Modulatory effects of Punica granatum L juice against 2115 MHz (3G) radiation-induced reproductive toxicity in male Wistar rat

Environmental Science and Pollution Research - Advancements in telecommunication sector result in increasing exposure to electromagnetic (EM) radiation, which has been correlated with incidence of...     

Microbial decolorization of synthetic dyes and reactive dyes of industrial effluents by using a novel fungus Aspergillus proliferans

A decolorizing fungal strain was isolated and identified by the morphology and genotypic characterization as Aspergillus proliferans. The effect of A. proliferans on decolorization of synthetic dyes (70 mg ml(-1)) and colored effluent was evaluated in liquid culture medium. A. proliferans expressed their effective decolorization activity in effectual decolorization of synthetic dyes and industrial effluent. Synthetic dyes were decolorized by 76 to 89% within 6 days of treatment and 73.5% of color was removed in industrial effluent within 8 days. The addition of optimum carbon and nitrogen sources were effectively stimulated the decolorization activity. The high concentration of glucose repressed the decolorization activity and supplementation of yeast extract has significantly enhanced the effluent decolorization at p < 0.05. Laccase enzyme was isolated from liquid state fermentation, which showed significant enzyme activity (10,200 Uml(-1)) at p < 0.005. The crude enzyme decolorizes the dyes aniline blue and congo red in 14 hours (40.9 to 70%) and the effluent in 14 hours (88.6%). Moreover, the culture free supernatant without the fungal biomass has also effectively decolorized the effluent and synthetic dyes. The fungi Aspergillus proliferans was used not only for decolorization but also for better bioremediation of industrial effluent.     

Correction to: Metal accumulation and health risk assessment in wastewater used for irrigation around the Agra Canal in Faridabad,India

Environmental Science and Pollution Research -