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Mathematical model for abrasive content estimation in a pulse-electroplated abrasive microtool
Authors:Anuj Dabholkar  Murali M Sundaram
Institution:School of Dynamic Systems, University of Cincinnati, Cincinnati, OH, USA
Abstract:A mathematical model was developed to estimate the weight percent of diamond abrasive particles incorporated in nickel binder matrix during abrasive microtool fabrication by pulse-plating process. The proposed model is based on the hypothesis that, embedment of an inert micro abrasive diamond particle on the substrate will only occur when a few nickel ions from the adsorbed ionic cloud are chemically reduced at the cathode by hydrogen ions present in the diffusion layer. Experimental verification of the model developed was performed by pulse electroplating of diamond abrasive particles on tungsten micro tool shank using an in-house built experimental setup. The predictive model developed was found to estimate diamond abrasive content in nickel binder matrix within 1–7 wt% of experimental results for different pulse-plating conditions.
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