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Wireless acquisition of temperature data from embedded thin film sensors in cutting insert
Authors:Anshuman Guha  Hang Li  Zhenguo Sun  Chao Ma  Dirk Werschmoeller  Xiaochun Li
Institution:1. Department of Mechanical Engineering, University of Wisconsin-Madison, USA;2. Department of Mechanical Engineering, Tsinghua University, PR China;3. Department of Electrical and Computer Engineering, University of Wisconsin-Madison, USA
Abstract:This paper presents the results of wireless data acquisition experiments from embedded micro thin film sensors in cutting inserts for machining. A bluetooth module is used to acquire data and establish communication with a receiver PC over the serial port profile (SPP). A signal conditioning circuit is designed and developed to increase the signal-to-noise ratio of the embedded micro thin film sensors. Moreover, an averaging filter algorithm is implemented as a software interface. To characterize the wireless data acquisition (DAQ) system, laser heating and turning tests are conducted. Both tests show that the wireless DAQ system is able to provide desirable capabilities as well as the wired one for the embedded thin film sensors in cutting inserts.
Keywords:
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