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Rule of formation of aluminum electroplating layer on Q235 steel
Authors:Zhimin Ding  Qiuyuan Feng  Changbin Shen  Hong Gao
Institution:1. College of Materials Science and Engineering, Dalian Jiaotong University, Dalian 116028, China;2. State Key Laboratory for Corrosion and Protection, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China;3. Province Key Laboratory for Fabrication and Application of Super-fine Inorganic Powders, Dalian 116028, China;1. China Institute of Atomic Energy, P.O. Box 275-55, Beijing 102413, PR China;2. Hydrogen Isotope Research Center, University of Toyama, Toyama 930-8555, Japan;1. Institute of Materials, China Academy of Engineering Physics, Mianyang 621900, China;2. Key Laboratory of Materials Modification (Ministry of Education), Dalian University of Technology, Dalian 116024, China;1. MPD, India;2. FRMS, BARC, Mumbai, India;3. IIT Kharagpur, India;1. Key Laboratory of Bio-Inspired Smart Interfacial Science and Technology of Ministry of Education, Beijing 100191, China;2. Beihang University, Beijing 100191, China;1. Department of Physics, TM Bhagalpur University, Bihar, India;2. TNB, TM Bhagalpur University, Bihar, India;3. COAST, Amity University, Jaipur, Rajasthan, India
Abstract:Aluminum electroplating layer on Q235 steel in AlCl3-NaCl-KCl molten salt was obtained, and the rule of its nucleation and growth were investigated. The results showed that aluminum electroplating layer formed through nucleating and growing of aluminum particles, and thickened by delaminating growth pattern. At low current density, the morphology of aluminum particles took on flake-like, while at high current density they changed to spherical. The thickness of plating layer increases with increasing current density and electroplating time. The relationship between the plating thickness (δ) and electroplating time (t) or current density (i) can be expressed as δ = 0.28f137, and δ = 1.1i1-39.
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