| 塑封电子元器件温度失效机理研究 |
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| 引用本文： | 路浩天,卢晓青,蔡良续. 塑封电子元器件温度失效机理研究[J]. 装备环境工程, 2012, 9(6): 36-39,43 |
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| 作者姓名： | 路浩天 卢晓青 蔡良续 |
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| 作者单位： | 中国航空综合技术研究所,北京 100028 |
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| 摘 要： | 应用非破坏性检测技术和破坏性显微分析技术对塑封电子元器件在温度循环试验中发生的失效进行了分析，通过研究缺陷发展的过程并结合现有检测标准要求，提出了对器件设计改进和完善现有检测标准的建议。
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| 关 键 词： | 塑料封装 温度效应 缺陷 |
| 收稿时间： | 2012-09-01 |
| 修稿时间： | 2012-12-15 |
Study on Temperature Effect of Plastic Encapsulated Microcircuit |
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| LU Hao-tian,LU Xiao-qing and CAI Liang-xu. Study on Temperature Effect of Plastic Encapsulated Microcircuit[J]. Equipment Environmental Engineering, 2012, 9(6): 36-39,43 |
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| Authors: | LU Hao-tian LU Xiao-qing CAI Liang-xu |
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| Affiliation: | (China Aero-polytechnology Establishment, Beijing 100028, China) |
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| Abstract: | Failure analysis of plastic encapsulated microcircuit in temperature recycle test was carried out by using non-destructive technique and destructive microscopy analysis technique. The development of defects was studied. Suggestions were put forward on improvement of device design and existing standards. |
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| Keywords: | plastic encapsulated temperature effect defects |
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