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无铅焊点可靠性及验证试验
引用本文:安利全,叶紫薇,郑建明.无铅焊点可靠性及验证试验[J].装备环境工程,2010,7(6):91-93,129.
作者姓名:安利全  叶紫薇  郑建明
作者单位:北京自动化控制设备研究所,北京100074
摘    要:针对无铅器件在军品中应用的现状,结合国内外焊点可靠性研究模式,从影响无铅焊点可靠性因素、焊点失效模式、焊点可靠性试验等方面,阐述了无铅焊点可靠性的概念、研究试验方法和相关内容,为后续无铅焊点试验和工艺参数探索奠定了基础,并且利于不同试验的横向比较。

关 键 词:无铅焊点  可靠性

Reliability and Validation Test of Lead-free Solder Joint
AN Li-quan,YE Zi-wei,ZHENG Jian-ming.Reliability and Validation Test of Lead-free Solder Joint[J].Equipment Environmental Engineering,2010,7(6):91-93,129.
Authors:AN Li-quan  YE Zi-wei  ZHENG Jian-ming
Institution:(Beijing Automation Control Equipment Institute,Beijing 100074,China)
Abstract:Present situation of the application of lead-free component in armament and reliability research mode of lead-free joint were introduced.The concept and test method of lead-free joint reliability were introduced from lead-free solder joint reliability factors,solder joint failure modes,and solder joint reliability test.The purpose was to provide foundations for the follow-up lead-free solder joints experiments and process parameters exploration.
Keywords:lead-free solder joint  reliability
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