印刷电路组件吸湿性尘粒人工模拟试验中关键因素的控制 |
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引用本文: | 刘勇志,詹炀,钟浩,晋晓峰. 印刷电路组件吸湿性尘粒人工模拟试验中关键因素的控制[J]. 环境技术, 2016, 0(5): 19-22. DOI: 10.3969/j.issn.1004-7204.2016.05.007 |
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作者姓名: | 刘勇志 詹炀 钟浩 晋晓峰 |
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作者单位: | 1. 深圳市计量质量检测研究院,深圳,518055;2. 国家铜铅锌及制品质量监督检验中心,铜陵,244000 |
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摘 要: | 吸湿性尘粒人工模拟试验(简称湿尘试验)是一种新型的环境试验。通过对试验方法和试验过程中各环节的研究,确定了试验时应把握的关键因素,并最终总结了试验中关键因素控制的方法。这些方法可为湿尘试验的开展提供借鉴作用。
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关 键 词: | 印刷电路组件 湿尘试验 吸湿性尘粒 湿度阀值 人工模拟试验 关键因素 IPC-B-25试片 表面绝缘电阻 |
Controlling of Key Factors in Hygroscopic Dust Artiifcial Simulation Test for PCBA |
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Abstract: | Hygroscopic dust artificial simulation test (hygroscopic dust test) is a new type of environmental test. Through researching on the test method and the steps of test process, this paper determines the critical factors that should be grasped during the test, and summarizes the method for controlling these factors during the test. It provides reference for hygroscopic dust test. |
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Keywords: | printed wiring board assembly (PCBA) hygroscopic dust test hygroscopic dust threshold relative humidity (RHt) artificial simulation test critical factor IPC-B-25 coupon surface insulation resistance (SIR) |
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