| 焊点热疲劳失效原因分析 |
| |
| 引用本文： | 张伟,王君兆,邓胜良,马聪.焊点热疲劳失效原因分析[J].环境技术,2016(5):71-74. |
| |
| 作者姓名： | 张伟 王君兆 邓胜良 马聪 |
| |
| 作者单位： | 深圳市美信检测技术股份有限公司,深圳,518000 |
| |
| 摘 要： | 某PCBA样品在使用约半年后出现功能失效,该PCBA在封装后进行整体灌胶,将失效样品剥离,发现部分器件直接脱落,通过表面观察、切片分析、EBSD分析、应力分析、热膨胀系数测试等手段对样品进行分析,结果表明:各封装材料存在热失配,且焊点缺陷较多且存在应力集中区,加速焊点的疲劳失效进程,导致PCBA功能失效。
|
| 关 键 词： | EBSD 热疲劳 应力集中 热失配 |
Cause Analysis of Thermal Fatigue Failure of Welding Spot |
| |
| Abstract: | A PCBA sample has a functional failure after using about six months. After package, the PCBA is overall glued. Some devices directly fall off after peeling failed samples. Samples are analyzed by means of surface morphologic observation, micro cross section inspection, EBSD analysis, stress analysis, thermal expansion coefficient test and so on. The results show that the presence of thermal mismatch of materials, and a large amount of solder joint defects and the stress concentration accelerate solder joint fatigue failure process, which cause functional failure of PCBA. |
| |
| Keywords: | EBSD thermal fatigue stress concentration thermal mismatch |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
