用盐酸/正丁胺/硫酸铜法浸出废线路板中的铜

采用盐酸-正丁胺-硫酸铜混合体系,以铜为目标模拟物,通过改变盐酸浓度、正丁胺浓度、硫酸铜质量、温度等条件,建立并优化了废旧线路板中铜的浸出方法.结果表明,在盐酸浓度为1.75 mol/L、正丁胺浓度为0.25 mol/L、硫酸铜质量为0.96 g、温度为50℃的条件下,8 h后0.25 g铜可以完全被浸出.在此条件下,9 h后1 g废旧线路板样品中铜的浸出率可以达到95.31%.该体系对铜有较好的浸取效果,有反应条件温和、浸出液可以再利用等优点.

Newly Leaching Method of Copper from Waste Print Circuit Board Using Hydrochloric Acid /n-butylamine/Copper Sulfate

A newly leaching method of copper from waste print circuit board was established by using hydrochloric acid-n-butylamine-copper sulfate mixed solution. The conditions of leaching were optimized by changing the hydrochloric acid, n-butylamine, copper sulfate,temperature and other conditions using copper as target mimics. The results indicated that copper could be leached completely after 8 h at 50 degrees C, hydrochloric acid concentration of 1.75 mol/L, n-butylamine concentration of 0.25 mol/L, and copper sulfate mass of 0.96 g. Under the conditions, copper leaching rates in waste print circuit board samples was up to 95.31% after 9 h. It has many advantages such as better effects, low cost, mild reaction conditions, leaching solution recycling.