| 温度循环下塑封器件可靠性评估分析 |
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| 引用本文： | 李永正,李昕昕,党炜,孙卓午,张泽明.温度循环下塑封器件可靠性评估分析[J].装备环境工程,2018,15(8):83-87. |
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| 作者姓名： | 李永正 李昕昕 党炜 孙卓午 张泽明 |
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| 作者单位： | 中国科学院空间应用工程与技术中心 |
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| 基金项目： | 中国科学院青年创新促进专项基金（CASYI2014135） |
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| 摘 要： | 目的评估塑封器件的热疲劳寿命和可靠性。方法分析NASA和ECSS空间任务用低等级器件评估标准,针对某型号任务用的两种塑封器件制定了温度循环评估方案。在-55~+125℃进行500次温度循环,配合外观检查、X射线检查、声学扫描显微镜检查、常温测试检测项目。结果 SOP-8(Small Out-line Package)器件评估合格,各项检测试验项目合格,其可靠性寿命满足某型号任务单机载荷2年需求。SOT-23(Small Out-line Transistor Package)器件出现功能失效,分层扩展至整个焊板区域,内部键合丝断裂,电参数失效比例为95%。结论塑封器件评估需要制定有针对性的评估方案,经评估验证,部分塑封器件的可靠性可满足高可靠领域任务需求,兼备高可靠性与高性能。
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| 关 键 词： | 塑封器件 温度循环 评估 可靠性 |
| 收稿时间： | 2018/5/3 0:00:00 |
| 修稿时间： | 2018/8/25 0:00:00 |
Reliability Evaluation and Analysis of Plastic Encapsulated Device Based on Temperature Cycle |
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| LI Yong-zheng,LI Xin-xin,DANG Wei,SUN Zhuo-wu and ZHANG Ze-ming.Reliability Evaluation and Analysis of Plastic Encapsulated Device Based on Temperature Cycle[J].Equipment Environmental Engineering,2018,15(8):83-87. |
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| Authors: | LI Yong-zheng LI Xin-xin DANG Wei SUN Zhuo-wu and ZHANG Ze-ming |
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| Institution: | Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China,Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China,Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China,Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China and Technology and Engineering Center for Space Utilization, Chinese Academy of Sciences, Beijing 100094, China |
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| Abstract: | |
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| Keywords: | plastic encapsulated device temperature cycle evaluation reliability |
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