| SMT-PGA封装焊点热疲劳寿命预计模型研究 |
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| 引用本文： | 夏丽娇,李小岩.SMT-PGA封装焊点热疲劳寿命预计模型研究[J].装备环境工程,2017,14(1):21-23. |
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| 作者姓名： | 夏丽娇 李小岩 |
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| 作者单位： | 1. 中国信息通信研究院,北京,100191;2. 中国航空综合技术研究所,北京,100191 |
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| 摘 要： | 目的研究SMT-PGA封装焊点热疲劳寿命预计模型。方法运用Engelmaier模型预测SMT-PGA封装焊点的热疲劳寿命,并将Engelmaier模型计算结果与美国马里兰大学CALCE PWA寿命评估软件仿真结果作对比。结果模型计算结果与马里兰大学寿命评估软件仿真结果存在较大差异。结论表明Engelmaier模型中的工程因子F并不是一个固定常数,而是受封装最低稳态温度的影响。
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| 关 键 词： | 热疲劳 SMT-PGA封装 焊点 工程因子F |
| 收稿时间： | 2016/8/30 0:00:00 |
| 修稿时间： | 2017/1/15 0:00:00 |
Thermal Fatigue Life Predication Model of Solder Joints for SMT-PGA Package |
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| XIA Li-jiao and LI Xiao-yan.Thermal Fatigue Life Predication Model of Solder Joints for SMT-PGA Package[J].Equipment Environmental Engineering,2017,14(1):21-23. |
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| Authors: | XIA Li-jiao and LI Xiao-yan |
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| Institution: | China Academy of Information and Communication Technology, Beijing 100191, China and China Aero-Polytechnology Establishment, Beijing 100191, China |
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| Abstract: | Objective To study the thermal fatigue life prediction model of solder joints for SMT-PGA package. Methods The thermal fatigue life of SMT-BGA package solder joints was predicted based on the Engelmaier model; and then it was compared with simulation results of CALCE PWA life assessment software of University of Maryland. Results The calculated results were quite different from the simulation results of CALCE PWA software. Conclusion Engineering factor F in the Engelmaier model is not a fixed constant but affected by the minimum steady state temperature of package. |
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| Keywords: | thermal fatigue SMT-PGA package solder joint engineering factor F |
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