Metal microchannel lamination using surface mount adhesives for low-temperature heat exchangers

This paper reports the feasibility of using surface mount adhesives to produce low temperature microchannel arrays in a wide variety of metals. Sheet metal embossing and chemical etching processes have been used to produce sealing bosses that eliminate channel laminae, resulting in approximately 50% material savings over traditional methods. An assembly process using adhesive dispense and cure is outlined to produce leak-free devices. Optimal fill ratios were determined to be between 1.1 and 1.25. Bond strength investigation reveals robustness to surface conditions and a bond strength of 5.5–8.5 MPa using a 3X safety factor. Dimensional characterization reveals a two sigma (95%) post-bonded channel height tolerance under 10% after bonding. Patterning tolerance and surface roughness of the laminae faying surfaces were found to have a significant influence on the final post-bonded channel height. Leakage and burst pressure testing on several samples has established confidence that adhesive bonding can produce leak-free joints. Operating pressures up to 413 kPa have been satisfied, equating to tensile pressure on bond joints of 1.9 MPa. Higher operating pressures can be accommodated by increasing the bond area of devices.