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化学机械研磨废水处理及回用技术的研究进展
引用本文:罗助强,王峰,杨海真.化学机械研磨废水处理及回用技术的研究进展[J].环境科学与技术,2012,35(3):127-131.
作者姓名:罗助强  王峰  杨海真
作者单位:同济大学污染控制与资源化研究国家重点实验室,上海,200092
基金项目:水利部“节水型社会建设”项目(水综节水[2010]42号);农村分散型污水处理关键设备研制与示范项目(2009BAC57B01)
摘    要:化学机械研磨废水产生量大但总体污染物浓度不高,回用潜力巨大,其处理及回用技术是芯片制造企业的研究重点。文章介绍了化学机械研磨废水来源、水质特征,概述并对比分析了常用的化学机械研磨废水处理和回用技术及其应用现状和发展趋势,并指出以膜滤或电化学处理为主的处理及回用技术具有良好的运用前景。

关 键 词:芯片制造  化学机械研磨废水  处理  回用

Progress on Treatment and Reuse Technologies of Chemical Mechanical Polishing (CMP) Wastewater
LUO Zhu-qiang , WANG Feng , YANG Hai-zhen.Progress on Treatment and Reuse Technologies of Chemical Mechanical Polishing (CMP) Wastewater[J].Environmental Science and Technology,2012,35(3):127-131.
Authors:LUO Zhu-qiang  WANG Feng  YANG Hai-zhen
Institution:(State Key Laboratory of Pollution Control and Resource Reuse,Tongji University,Shanghai 200092,China)
Abstract:A large volume of chemical mechanical polishing(CMP) wastewater has been generated each year,however the pollutant concentration in CMP wastewater is not so high that it has considerable potential of reuse.The treatment and reuse technologies of CMP wastewater is becoming a focus of wafer fabrication industry.Sources and characters concerning CMP wastewater was introduced,the conventional treatment and reuse technologies of CMP wastewater as well as its present application status and development trend were analyzed.Ultrafiltration and electrochemical treatment process would become the dominant way of CMP treatment and reuse.
Keywords:wafer fabrication  chemical mechanical polishing(CMP) wastewater  treatment  reuse
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