电子产品故障物理模型研究与应用进展

提出了故障物理模型的基本概念,对几种常见的电子产品故障物理模型,包括互连热疲劳模型、互连振动疲劳模型、电迁移模型和与时间相关的介质击穿模型等进行了分析,总结提出了基于失效发生因素和失效发生过程的损伤模型建模等两种故障物理模型的建模方法。结合工程应用情况,对两种故障物理模型的应用方法——可靠性仿真分析方法和可靠性加速试验方法进行了讨论。最后对故障物理模型的研究进行了展望。

Progress in Research and Application of Failure Physical Model for Electronic Products

The basic concept of failure physical model was proposed, and several common failure physical models for electronic products were introduced, such as interconnection thermal fatigue model, interconnection thermal fatigue model, interconnection vibration fatigue model, electro-migration model, and time-dependent dielectric breakdown model. Two modeling methods for failure physical models were proposed, including the damage modeling based on failure factors and the damage modeling based on failure processes. In combination with the engineering applications, two application methods of failure physical models were discussed, namely, reliability simulation analysis method and accelerated reliability test method. Finally, the research on failure physical models was prospected.