基于SEM图像处理法的化学镀Ni-P合金表面改性基底层孔隙表征

目的对Ni-P合金表面层孔隙进行定量表征。方法通过SEM微观形貌图像分析孔隙分布,运用ImageJ软件对SEM图像进行处理,并统计分析Ni-P合金表面层孔隙的孔隙率、孔隙数目、等效直径等数据。结果电化学蚀刻在改性Ni-P合金表面层制备微孔层,随时间延长,表面微孔数量增多、孔径增大。蚀刻1,3,5 min的孔隙率分别为0.85%,4.34%,11.18%,蚀刻5 min后微孔发生交联,Ni-P合金层防护性能被破坏。结论电化学蚀刻3 min可在Ni-P合金表面层获得分布均匀、等效直径主要分布在100~850 nm之间的微孔。

Characterization of Microporous on Modified Base of Ni-P Alloy Based on SEM Processing Technique

Objective to study the quantitative characterization of surface layer pores of Ni-P alloy. Methods Microporous distribution was analyzed by observing SEM microstructure image. The software Image was adopted to treat SEM image and analyze porosity, number of pores, equivalent diameter, etc. on Ni-P alloy surface. Results A microporous layer was prepared on the modified NI-P surface by electrochemical etching. The amount of microporous and the aperture of pores were increased with time. The porosity of microporous after etching for 1min, 3min and 5min was 0.85%, 4.34% and 11.18%. The protection performance of Ni-P alloy was destroyed after etching 5min for. Conclusion After etching for 3min, the microporous of Ni-P layer with the equivalent diameter are distributed uniformly in the range of 100~850 nm.