电子封装行业化学有害因素职业暴露评价

以法规及风险评价模型为基础,对电子封装行业内通常使用的化学有害因素进行职业暴露分析,将健康风险进行分级、定量评价,得出结论:行业中回流焊工艺可能产生的铅烟、电镀车间存在的硝酸、失效分析中使用的氢氟酸等,其职业暴露风险为中等风险水平;但由于化学物质的健康危害等级HR因其固有性而相对不变,而其会随控制措施的效果高低而变化的暴露等级ER是一个可变的要素,不同企业的控制措施的水平高低不同,其最终的风险等级可能是不同的。行业中使用的氢氧化钾、氢氧化钠的职业暴露风险为低风险水平,前提也是在合理有效的控制措施环境下。因此,控制措施的水平就是决定风险等级的最重要因素。时时地运行和维护有效的控制措施,是确保风险水平不发生变化的关键。

Chemical Exposure Assessment in Semiconductor Assembly Industry

Based on regulations and risk assessment model,occupational exposure to chemical hazards typically used in semiconductor assembly industry is analyzed and evaluated with the result of classified & quantified health risks,the conclusions are drawn as follows: Lead fume possibly produced in the solder-reflow process,nitric acid used in plating workshop and hydrofluoric acid used in failure analysis lab have an occupational exposure risk of moderate level;but the health hazard rate(HR) of these chemicals is comparatively fixed because of their inherent quality;the exposure rate(ER) is a variable factor due to the different efficacy of control method.So,different levels of control measures will result in different risk levels.There is a low level of occupational exposure risk for potassium hydroxide and sodium hydroxide used in industry,just because they are premised to be under a reasonable and effective control.Therefore,the level of control measures is the most important factor to decide risk grade.Always running and maintaining effective control measures is the key to ensure risk level unchangeable.