| HAST试验对塑封器件分层的影响分析 |
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| 引用本文： | 黄炜,白璐.HAST试验对塑封器件分层的影响分析[J].环境技术,2014(5):56-58. |
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| 作者姓名： | 黄炜 白璐 |
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| 作者单位： | 中国电子科技集团公司 第二十四研究所,重庆,400060 |
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| 摘 要： | 选取三种具有一定代表性的塑封产品，严格按照军用级标准GJB 7400对塑封电路筛选、预处理后，进行HAST试验摸底，验证HAST环境试验对国产塑封器件的影响，并提出军用塑封器件在设计时的注意事项。
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| 关 键 词： | 塑封器件 强加速稳态湿热 可靠性 塑封分层 |
The Inlfuence of HSAT for Plastic Encapsulated Microelectronics Devices |
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| HUANG Wei,BAI Lu.The Inlfuence of HSAT for Plastic Encapsulated Microelectronics Devices[J].Environmental Technology,2014(5):56-58. |
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| Authors: | HUANG Wei BAI Lu |
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| Institution: | (Sichuan Institute of Solid State Circuits, China Electronics Technology Group Crop., Chongqing 400060) |
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| Abstract: | The paper selects three kinds of representative plastic encapsulated microelectronics devices, after filtering and preprocessing PEM strictly according to military grade standard of GJB 7400, the influence of HAST environmental test to the PEM made in China is analyzed. Finally, the matters needed attention in the design of military PEM is proposed. |
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| Keywords: | PEM HAST reliability delamination |
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