| LED失效分析手段研究 |
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| 引用本文： | 胡春田,张华.LED失效分析手段研究[J].环境技术,2014(5):52-55. |
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| 作者姓名： | 胡春田 张华 |
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| 作者单位： | 深圳市计量质量检测研究院,深圳,518055 |
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| 摘 要： | 介绍LED产品常见的失效分析手段，主要包含外观检查、电性能测试、X-Ray透视检查、开封检查、金相切片分析、扫描电镜和能谱分析等手段，并结合实际案例对几种方法进行描述。
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| 关 键 词： | LED 失效分析 X-Ray 开封 金相切片 扫描电镜 能谱仪 |
The Failure Analysis Means of LED |
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| HU Chun-tian,ZHANG Hua.The Failure Analysis Means of LED[J].Environmental Technology,2014(5):52-55. |
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| Authors: | HU Chun-tian ZHANG Hua |
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| Institution: | (Shenzhen Academy of Metrology ＆ Ouality Inspection, Shenzhen 518055) |
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| Abstract: | This paper introduces the common means of LED failure analysis, mainly including visual inspection, electrical performance test, X-Ray inspection, decapsulation inspection, microsection inspection, SEM ＆ EDS analysis, etc., and it describes these methods combined with actual cases. |
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| Keywords: | LED failure analysis X-Ray decap microsection SEM (scanning electron microscope) EDS (energy disperse spectroscopy) |
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